congatec has introduced its first COM-HPC Mini computer-on-module based on Qualcomm Dragonwing IQ-X Series processors. The conga-HPC/mIQ-X uses the Qualcomm Oryon CPU and an integrated Hexagon NPU to support local AI workloads, including machine learning inference and large language model execution. The module delivers up to 45 TOPS of AI performance and is intended for edge systems in security, retail, robotics, medical devices, and industrial automation.
The module measures 95 mm × 70 mm and includes soldered LPDDR5X memory with options up to 64 GB. It supports an operating temperature range from −40 °C to +85 °C. Typical applications include video surveillance, sensor-based analytics, and systems requiring on-device AI processing. The platform supports Microsoft Windows on Arm and includes UEFI-compatible firmware to simplify integration.
The feature set includes up to 12 Oryon CPU cores, a Hexagon NPU, DSP, and Qualcomm Spectra ISP for processing video, image, and audio data. Graphics are driven by an Adreno GPU with support for up to three displays and 8K output. Connectivity options include two 2.5 Gb Ethernet ports, up to 16 PCIe Gen3/Gen4 lanes, two USB4 ports, two USB 3.2 Gen 2×1 ports, eight USB 2.0 ports, dual DDI and eDP display outputs, and interfaces for up to four MIPI CSI cameras. Additional interfaces include I²C, UART, and GPIO, and a TPM 2.0 device is included for hardware security.
congatec provides cooling solutions, evaluation boards, and design support, and also offers the module as an application-ready aReady.COM configuration with validated operating systems and optional IoT-focused software.
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