KIOXIA America, Inc. announced sampling1 of the industry’s first2 Universal Flash Storage3 (UFS) Ver. 4.0 embedded flash memory devices3 designed for automotive applications. These new, higher performing devices deliver fast embedded storage transfer speeds in a small package size and are targeted to a variety of next-generation automotive applications, including telematics, infotainment systems and ADAS4. The improved performance5 of UFS products […]
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Embedded flash memory complies with JEDEC e-MMC Ver. 5.1 spec
KIOXIA America, Inc. announced that it has begun sampling the latest generation of its JEDEC1 e-MMC Ver. 5.12-compliant embedded flash memory products for consumer applications. The new products are available in capacities of 64 and 128 gigabytes (GB) and integrate the company’s BiCS FLASH 3D flash memory and a controller in a single package. Demand for mid-range […]
JEDEC XFM removable storage device complies with Ver.1.0 PCIe/NVMe Spec
KIOXIA America, Inc. announced sampling of the industry’s first XFM DEVICE Ver.1.0-compliant removable PCIe standard attached, NVMe storage device: the XFMEXPRESS XT2. With a new form factor and connector, the XFM DEVICE Ver.1.0 standard delivers a combination of features designed to advance ultra-mobile PCs, IoT devices, and a variety of embedded applications. First introduced in […]
Automotive flash memory devices available in capacities to 512 GB
KIOXIA America, Inc. announced that it has started sampling new Automotive Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices. The new lineup utilizes KIOXIA cutting-edge BiCS FLASH 3D flash memory and is available in capacities from 64 gigabytes (GB) to 512GB to support the various requirements of evolving automotive applications that elevate driver experiences. […]
UFS embedded flash memory suports MIPI M-PHY v5.0
KIOXIA America, Inc. announced sampling1 of the industry’s first2 Universal Flash Storage (UFS)3 embedded flash memory devices supporting MIPI M-PHY v5.04. The new lineup utilizes the company’s BiCS FLASH 3D flash memory and is available in three capacities: 128GB, 256GB, and 512GB. The new devices deliver high-speed read and write performance and are targeted to a variety of […]
UFS Ver. 3.3 embedded flash memory devices incorporate QLC technology for high density applications
KIOXIA America, Inc. announced the launch of its Universal Flash Storage (UFS)* Ver. 3.1 embedded flash memory devices with 4-bit-per-cell, quadruple-level cell (QLC) technology. For applications needing high density, such as cutting-edge smartphones, KIOXIA QLC technology enables the capability to achieve the highest densities available in a single package. The new 512 Gigabyte** QLC UFS PoC […]
Serial-attached SCSI 24G SSDs target servers, enterprise storage
KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) became the first company to bring 24G SAS to server and storage applications with the introduction of its 6th-generation enterprise SAS SSD family. First demonstrated at Flash Memory Summit 2019, KIOXIA’s new PM6 Series of enterprise SAS SSDs is built on 24G SAS technology. Designed for modern IT […]
