Newark element14 has announced the availability of the Cypress PSoC 6 BLE Pioneer Kit, the perfect way for engineers to get started with next-generation IoT Designs using the new PSoC 6 MCU, which is purpose-built for the IoT, from Cypress Semiconductor Corp. “The PSoC 6 MCU is an IoT game changer which eliminates the need for […]
Embedded solid-state drive chips support JEDEC eMMC 5.1 standard
Greenliant Systems is now sampling its eMMC 5.1 NANDrive embedded solid state drive (SSD) product family with improved performance, enhanced features and a wide range of capacities (8, 16, 32, 64 and 128 GB). Ideal for automotive, industrial, medical, security, military and networking applications, the new GLS85VM NANDrive devices support the JEDEC eMMC 5.1 standard […]
Wireless chips first to offer full MU-MIMO, OFDMA uplink/downlink based onIEEE 802.11ax standards
Marvell announced the Marvell 802.11ax product family, offering a full MU-MIMO and OFDMA uplink and downlink based on the latest IEEE 802.11ax standards which will help the next generation of high-end users, “Generation Upload,” with real-time cloud-based requirements. Delivering consistent performance and reliability is becoming increasingly difficult for networks already straining to support a dramatic increase in […]
IoT Eclipse-based development environment supports embedded system scripting language
Telit announced the immediate availability of version 4.0 of its IoT development environment, the IoT AppZone. The new version of IoT AppZone expands features for the well-established flagship AppZone C and adds new functionality including an emulator and support for Lua, a lightweight scripting language optimized for embedded systems that are constrained by limited processing […]
LoRaWAN network gear sets up IoT schemes quickly
Newark element14 announced the availability of a new range of LoRaWAN products from The Things Network. The Things Gateway, The Things Uno and The Things Node, enable users to create LoRaWAN internet of things networks quickly and easily. Using The Things Network Gateway you can setup a LoRaWAN network in just 5 minutes – you can […]
Mobile platform includes visual processor for high-dynamic range, HD images
Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated has introduced the new Qualcomm Snapdragon 845 Mobile Platform. Thoughtfully designed with tech-savvy consumers in mind, Snapdragon 845 utilizes Qualcomm Technologies’ industry-leading wireless heterogenous compute expertise to design a platform for immersive multimedia experiences including eXtended reality (XR), on-device artificial intelligence (AI), lightning-fast connectivity, and introduces our […]
DLP processor chipsets handle 4k UHD display tasks
Texas Instruments has announced an expanded family of chipsets to bring 4K UHD technology to new applications. Building on the introduction of the DLP660TE chipset, the first affordable 4K UHD offering in the industry, the portfolio now includes two smaller chipsets, the DLP470TE and DLP470TP, to expand the sharp image capabilities of 4K UHD into a broader range of end equipment. Developers […]
Module supports deterministic, time-triggered Ethernet functions
North Atlantic Industries, Inc. (NAI), designer and manufacturer of embedded computing electronics worldwide, announces the availability of the TE1 single-port, triple-redundant Ethernet function module to support time-sensitive networking applications. The TE1 module supports all three traffic classes: Deterministic Ethernet Capability Time-Triggered Ethernet SAE AS6802 (TTEthernet); ARINC664 Part 7 and Avionics Full-Duplex Switched Ethernet (AFDX); or […]
Embedded analytics platform for design and debug of real-time systems
Embedded software systems – which are at the heart of a variety of electronic products from lightweight IoT sensors to high-performance computing (HPC) platforms – are prone to sporadic errors that can be hard to spot and virtually impossible to predict or to prevent from reoccurring. At the same time, traditional chip design requires the […]
Field of memory system improvements could lead to shrinking SRAM on SoCs
Leti, a research institute of CEA Tech, demonstrated significant improvements in the field of memory systems at IEDM 2017 this week. These include reconfiguring Static Random-Access Memory (SRAM) into Content-Addressable Memory (CAM), improving non-volatile crossbar memories and using advanced Tunnel Field-Effect Transistors (TFET). Another breakthrough presents a high-density SRAM bitcell on Leti’s CoolCubeTM 3D platform, […]