Celeno Communications, a leading provider of smart, innovative Wi-Fi solutions, is launching the world’s first single chip solution for client devices combining Wi-Fi 6/6E, BT/BLE (Bluetooth/ Bluetooth Low Energy) 5.2 and Celeno’s novel Wi-Fi Doppler Radar. Celeno’s new CL6000 “Denali” product family provides a connectivity and sensing solution for devices such as consumer multimedia devices, IoT […]
Mobile PCI Express Modules target resource-constrained edge computing/embedded AI apps
ADLINK Technology Inc., today introduced the industry’s first embedded MXM-based graphics modules based on NVIDIA’s Turing architecture, to accelerate edge AI inference in SWaP-constrained applications. GPUs are increasingly used to provide AI inferencing at the edge, where size, weight and power (SWaP) are key considerations. The embedded MXM graphics modules offer high-compute power required to […]
Transceiver eval kit handles optical gigabit connectivity in vehicles
KDPOF presents the new extensive evaluation kit EVK9351AUT for a quick and easy project launch of optical gigabit connectivity in vehicles. “Our new EVK9351AUT equips carmakers, suppliers, and test houses to fully evaluate the KDPOF automotive transceivers KD9351 and KD1053 for automotive optical 1000BASE-RHC PHY implementation,” explained Carlos Pardo, CEO and Co-founder of KDPOF. “We […]
Toolbox enables Simulink, MATLAB model execution on embedded processors
Green Hills Software, announced today the immediate availability of the MULTI Toolbox for Embedded Coder, enabling engineers to easily and efficiently develop and deploy their Simulink and MATLAB models on a wide range of embedded processors. The integration bridges advanced software development products from industry leaders in their respective domains – MathWorks, the leading developer […]
Development tools for TraveoTM II MCUs optimized for auto-body electronics apps
IAR Systems, presents a complete set of development tools for the TraveoTM II family of microcontrollers (MCUs) from Infineon, bringing a powerful solution with AUTOSAR support to companies working with automotive body electronics applications. In addition, IAR Systems provides an online IAR Academy On Demand training course specifically aimed for developers who are new to […]
Rad-hardened Arm MCU includes added embedded analog capabilities
Deep space initiatives including planetary exploration, orbiter missions and space research require innovative spacecraft system technology providing connectivity and processing. To enable system designers better integration and higher performance while reducing development costs and time to market, COTS technologies and scalable solutions are increasingly used in space applications. Microchip Technology Inc. today announced the qualification […]
LTE-M and NB-IoT communications modules now support 400 – 450 MHz LTE spectrum bands
ublox has extended its SARA-R5 LTE-M and NB-IoT communications family with the introduction of a module that supports the 400-450 MHz LTE spectrum bands available in Europe, Asia, and Latin America. The u-blox SARA-R540S can communicate on LTE bands 31, 72, 73, 87, and 88. These lower-frequency bands have good propagation characteristics, helping customers in […]
IoT mesh eval kit covers wireless IoT testing
Fujitsu Components America, Inc. has released a low-cost IoT Connectivity Solutions Mesh evaluation kit that simplifies feasibility testing of all use cases for wireless IoT solutions driven by fully scalable and robust Wirepas mesh technology and Fujitsu hardware. Each Fujitsu mesh evaluation kit ships with all the required components and tools to build a mesh network […]
EtherCAT modules integrated hardware and software to modernize IIoT-based smart factories
ADLINK Technology Inc., a global leader in edge computing, introduces two new modules in the 6-CH EU Series digital I/O – the ECAT-4XMO motion control and trigger module, and the ECAT-TRG4 trigger modules. The new modules are a dynamic extension to ADLINK’s EtherCAT System and are designed to perfectly complement the EU Series, enabling higher […]
Industrial-rated carrier provides extensive connectivity for Type 10 mini-module designs
WINSYSTEMS today introduced its first Mini-ITX form factor carrier board to complement and support its COMeT10-3900 COM Express Type 10 mini modules. The ITX-M-CC452-T10 carrier platform is designed with industrial components for testing products in development and to deliver highly reliable performance in operating environments with temperatures of -40°C to +85C°. WINSYSTEMS’s newest COM Express market entry offers the assurance […]
