North Atlantic Industries, Inc. (NAI), designer and manufacturer of embedded computing electronics worldwide, announces the availability of the TE1 single-port, triple-redundant Ethernet function module to support time-sensitive networking applications. The TE1 module supports all three traffic classes: Deterministic Ethernet Capability Time-Triggered Ethernet SAE AS6802 (TTEthernet); ARINC664 Part 7 and Avionics Full-Duplex Switched Ethernet (AFDX); or […]
Applications
Image-stabilizing gyroscope brings shake-free photos in next-gen smartphones
Smaller, thinner smartphone camera modules can provide pin-sharp image stabilization and make extra space for new handset features, leveraging the reduced size, increased performance, and advanced vibration immunity of STMicroelectronics’ L20G20IS miniature 2-axis MEMS gyroscope. As the newest member of ST’s highly integrated Optical Image Stabilization device family, the L20G20IS measures just 2.0mm x 2.0mm x 0.7mm, liberating […]
Next-gen 4G LTE CAT 1-enabled LoRa gateway targets industrial networks
Device Solutions Inc today announced the availability of the next generation 4G LTE CAT1 enabled Cellio LoRa Gateway for wide area, long range, end-to-end monitoring of agriculture, cold chain, gas distribution, transportation, and many other industrial (IIoT/M2M) applications. The Cellio solution is a TOTAL solution – encompassing the hardware, software, wireless connectivity, cloud storage, and […]
Wi-Fi connectivity kit provides rapid prototype for cloud services connections
Renesas Electronics America Inc expanded its Renesas IoT Sandbox lineup with the new RX65N Wi-Fi Cloud Connectivity Kit, offering greater flexibility for developers creating new applications for the Internet of Things (IoT). Powered by Renesas IoT Sandbox, the RX65N Wi-Fi Cloud Connectivity Kit provides an easy-to-use platform for connecting to the cloud, evaluating IoT solutions, and creating […]
Stero-AEC linear far-field voice kit for smart devices
XMOS Ltd announced the XVF3500 voice processor which supports stereo-AEC, along with the world’s first stereo AEC far-field linear microphone array solution, the VocalFusion Stereo Evaluation Kit (XK-VF3500-L33). The XVF3500 voice processor delivers 2-channel full duplex acoustic echo cancellation (AEC). The solution is designed for developers working in the growing voice-enabled smart TV, soundbar, set-top […]
HDMI 2.1 IP for SoC designs includes High-Bandwidth Digital Content Protection 2.2 features
Synopsys announced its complete DesignWare HDMI 2.1 IP solution with High-Bandwidth Digital Content Protection (HDCP) 2.2 consisting of controllers, PHYs, verification IP, IP Prototyping Kit, and IP Subsystem as well as Linux software drivers. The IP supports advanced HDMI 2.1 features like fixed-rate link allowing uncompressed 8K resolution with 60 Hz refresh rate for a more immersive viewing […]
Voice processor development kit aids design of voice user-interface apps
XMOS today announced commercial availability of the xCORE VocalFusion Speaker Linear evaluation kit as part of its range of innovative far-field voice capture solutions. Based on the XMOS VocalFusion XVF3100 voice processor, the kit is designed for developers, OEMs and ODMs integrating voice user interfaces into flat, or linear consumer electronics typically found at the […]
Biometric sensors include advanced heart monitoring and ECG
Capturing your heart rate from your wearable watch or patch was slick. But fitness enthusiasts are raising the bar and expecting manufacturers to step up to the bar with them. As wearables continue to move into consumer health applications, end users are expecting additional metrics such as heart rate variability, recovery rate — basically as […]
Amazon FreeRTOS integrated into MCU platform
Enabling developers to quickly and securely connect Internet of Things (IoT) endpoints to the cloud, Texas Instruments announced the integration of the new Amazon FreeRTOS into the SimpleLink microcontroller (MCU) platform. Amazon Web Services (AWS) has worked with TI in the development of an integrated hardware and software solution that enables developers to quickly establish a […]
Universal FLASH storage devices use 64-layer BiCS FLASH 3D memory
Toshiba Memory America, Inc. (TMA) has begun sampling Universal Flash Storage (UFS) devices[ utilizing its cutting-edge 64-layer BiCS FLASH 3D flash memory. The new UFS devices meet performance demands for applications that require high-speed read/write performance and low power consumption, including mobile devices such as smartphones and tablets and augmented /virtual reality systems. The new lineup will be […]
