Synopsys, Inc. and Alango Technologies today announced that Alango Technologies’ Voice Enhancement Package (VEP) software has been optimized for Synopsys’ DesignWare® ARC® Data Fusion IP Subsystem. The VEP is a suite of real-time software DSP technologies designed for improving speech recognition performance in voice-controlled multimedia devices. The ARC Data Fusion IP Subsystem is a highly integrated hardware and software IP […]
Flash storage, comm software works with Xilinx Zynq-7000 All Programmable SoCs
HCC Embedded, experts in software for securely storing and communicating embedded data, has added support for the Xilinx Zynq-7000 All Programmable system-on-chip (SoC) family of devices. Developers using Xilinx Zynq-7000 SoCs now have access to HCC’s entire suite of advanced flash storage and communications middleware. Solutions for Zynq SoCs include fail-safe flash file systems; MISRA-compliant TCP/IP, TLS, […]
Chip design CAD software supports integrated fan-out advanced packaging, chip-on-wafer-on-substrate packaging technologies
Mentor, a Siemens business, today announced several enhancements to its Calibre® nmPlatform, Analog FastSPICE™ (AFS™) Platform, Xpedition® Package Integrator and Xpedition Package Designer tools in support of TSMC’s innovative InFO integrated fan-out advanced packaging and CoWoS® chip-on-wafer-on-substrate packaging technologies. The TSMC InFO and CoWoS 3D packaging technologies enable customers to mix multiple silicon dice on a single device and […]
Chip design CAD system supports 7-nm FinFET Plus and 12-nm FinFET process technologies
Mentor, a Siemens business, today announced certification for TSMC’s 12nm FinFET Compact Technology (12FFC) and the latest version of 7nm FinFET Plus processes for its Mentor Calibre® nmPlatformand Analog FastSPICE™ (AFS™) Platform. Nitro-SoCTM place and route system is also certified to support TSMC’s 12FFC process technology. “TSMC is pleased to work closely with Mentor, which continues to increase its […]
Logic libraries, embedded memory IP covers 40-nm ultra-low power, 40-nm low-power eFlash designs
Synopsys, Inc. announced its collaboration with TSMC to develop foundry-sponsored DesignWare Foundation IP, including logic libraries and embedded memories, for TSMC’s 40-nanometer (nm) ultra-low power (ULP) eFlash and 40-nm low-power (LP) eFlash processes. Synopsys’ Foundation IP on TSMC’s 40-nm eFlash processes implements unique features that enable designers to reduce power consumption for IoT designs. The logic […]
Mini-coupler patch panels save space in data center, LAN, MDF/IDF, gigabit ethernet connectivity apps
L-com Global Connectivity launched a new series of mini-coupler feed-thru patch panels for use with data center, LAN, MDF/IDF, and Gigabit Ethernet connectivity applications. The mini-couplers used in these panels provide the same performance and quality as full-size Ethernet couplers, but measure less than one inch in length. This design provides more room for installers to work […]
Multi-channel IoT transceiver SoT gets Thread Protocol certification
Qorvo announced that its GP712 System-on-Chip is the first multi-channel Internet of Things (IoT) transceiver in the industry to be certified for the Thread protocol. With concurrent support for Thread and ZigBee on different RF channels, the GP712 enables designers to use a single transceiver on their gateway products to simultaneously serve both IEEE802.15.4 implementations. The […]
Eight-bit MCU includes I2C, UART, and SPI interfaces
STMicroelectronics is extending choice and freedom for budget-conscious designers by introducing its new 8-bit STM8S001 microcontroller (MCU) in the economical SO-8 package. Unlike most rivals, the STM8S001 has I2C, UART, and SPI interfaces, giving unusually versatile connectivity options. With a generous 8KB Flash memory, 1KB RAM, 128-byte EEPROM, and 3-channel 10-bit ADC also on-chip, it delivers key […]
Chip IP helps implement advanced infotainment, ADAS SoCs in 16-nm FinFET Compact technology
Cadence Design Systems, Inc. today announced it is delivering a comprehensive automotive IP portfolio for the TSMC 16nm FinFET Compact (16FFC) automotive process technology. This broad IP portfolio enables a host of applications ranging from in-vehicle infotainment, in-cabin electronics, vision subsystems, digital noise reduction and advanced driver assistance system (ADAS) subsystems and is registered in […]
Dual-mode Bluetooth 4.2 host controller interface module includes embedded chip antenna and audio support
Telit, a global enabler of the Internet of Things (IoT), today announced the BL871E2-HI, a dual-mode Bluetooth 4.2 host controller interface module with embedded chip antenna and audio support. The ultra-compact component is optimized for efficiency and simplicity in end-device design, delivering reliable Bluetooth functionalities with robust endpoint security, leveraging the processing power and external […]