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Applications

PCI SIG release PCIe 7.0 specification

June 13, 2025 By Redding Traiger Leave a Comment

PCI-SIG announced the official release of the PCI Express (PCIe) 7.0 specification, reaching 128.0 GT/s, to members. PCIe 7.0 specification targets data-driven applications like AI/ML, 800G Ethernet, cloud, and Quantum computing. Pathfinding for the PCIe 8.0 specification is already in progress to continue supporting the industry’s investments and product roadmaps in the PCIe technology ecosystem. […]

Filed Under: Data centers, Ethernet, Tools Tagged With: pcisig

Linear redrivers support PCIe 6 with PAM4 modulation

June 12, 2025 By Redding Traiger Leave a Comment

Diodes Incorporated introduces the industry’s first ReDriver to reach PCI Express (PCIe) 6.0 protocol speeds (up to 64 GT/s) while being backward-compatible with PCIe 5.0/4.0/3.0 protocols. The PI3EQX64904 is a low-power, high-performance, 64GT/s, four-differential-channel, PAM4, linear ReDriver. Target applications include AI data centers (storage and servers), workstations, 5G networking, CPU-to-network (PCIe NIC card) and CPU-to-storage (NVME) […]

Filed Under: Artificial intelligence, Data centers, Diodes, Products, Tools Tagged With: diodesincoporated

Integrated USB-C, CAN, I3C and LP UART interfaces reduce external component requirements

June 11, 2025 By Redding Traiger Leave a Comment

Renesas Electronics Corporation introduced the RA2L2 microcontroller (MCU) group with ultra-low power consumption and the industry’s first support for the new UCB-C Revision 2.4 standard. Based on a 48-MHz Arm Cortex M23 processor, the new MCUs offer a rich feature set that makes them ideal for portable devices and PC peripherals such as gaming mice and […]

Filed Under: Data centers, microcontroller, Products, Tools Tagged With: renesaselectronicscorporation

MCUs integrate CAN FD controller and 3-phase PWM with AI accelerator

June 6, 2025 By Aimee Kalnoskas Leave a Comment

ROHM Semiconductor has announced the development of AI-equipped microcontrollers designated ML63Q253x-NNNxx and ML63Q255x-NNNxx that perform fault prediction and degradation forecasting using sensor data in industrial equipment including motors. These MCUs execute both learning and inference operations without requiring network connectivity, operating as standalone devices for real-time monitoring applications. The MCUs implement ROHM’s Solist-AI technology using […]

Filed Under: Applications, Artificial intelligence Tagged With: rohmsemiconductor

Board-mounted tactile switches focus on durability

June 3, 2025 By Redding Traiger Leave a Comment

Littelfuse, Inc. announced the launch of the KSC PF Series sealed tactile switches for surface-mount technology (SMT). These compact, IP67-rated momentary action switches deliver enhanced environmental protection through a unique extended cage design that simplifies the potting process and improves long-term durability in harsh environments. Engineered to support rugged applications across industrial, transportation, medical, aerospace, and […]

Filed Under: Industrial, PCB Design, Switches, Tools Tagged With: littelfuse

Multi-gigahertz clocks boast LVDS, CML, LVPECL output options

June 3, 2025 By Aimee Kalnoskas Leave a Comment

Mixed Signal Devices has announced its MS11X0 oscillator and MS15X0 jitter attenuator families for computing and communications systems. The timing devices are built on 28 nm CMOS technology and incorporate the company’s Virtual Crystal architecture to address requirements in AI data centers, 5G base stations, and radar applications. The MS1130 and MS1150 oscillators operate at […]

Filed Under: 5G, Applications, Artificial intelligence, Data centers, Wireless Tagged With: Mixed Signal Devices

Active cooling platform targets enterprise E3.S and consumer M.2 SSDs

May 30, 2025 By Aimee Kalnoskas Leave a Comment

xMEMS Labs, Inc. announced the expansion of its µCooling fan-on-a-chip platform to solid-state drives (SSDs). The technology enables in-drive active cooling for enterprise E3.S form factor SSDs used in AI data centers and NVMe M.2 SSDs used in laptop PCs. SSD thermal management has traditionally relied on passive heat spreaders and ambient airflow from system […]

Filed Under: Applications, Artificial intelligence, Data centers Tagged With: xMEM Labs Inc.

PCIe cards add solid-state storage to high-performance computers

May 29, 2025 By Redding Traiger Leave a Comment

HighPoint Technologies is changing the game with its new Rocket 7604A and Rocket 1604A PCIe Gen5 NVMe AICs, which deliver true x16 storage performance in a half-length, compact form factor. These solutions are ideal for small form factor tower servers, rackmount chassis, and edge computing environments where space is limited, but performance must remain uncompromised. […]

Filed Under: Artificial intelligence, Data centers, Products, Storage, Tools Tagged With: highpoint

Type 4 NFC tag features dual NFC and I2C interfaces with ISO/IEC 14443-4 compliance

May 28, 2025 By Redding Traiger Leave a Comment

NXP Semiconductors has announced the NTAG X DNA, a Type 4 secure connected NFC tag designed for product authentication and Digital Product Passport applications. The device features 16KB of memory and operates according to ISO/IEC 14443-4 standards, supporting both NFC and I2C communication interfaces. The NTAG X DNA incorporates secure, unique NFC authentication and operates […]

Filed Under: Consumer Electronics, Data centers, Industrial, Medical, Products, Tools Tagged With: nxpsemiconductors

What are the different key layers of IoT architecture? part 2

May 28, 2025 By Rakesh Kumar Leave a Comment

This second part of the FAQ discusses the three upper layers of the IoT architecture, which extend beyond the physical and network layers. The middleware layer processes and manages raw IoT data from connected devices. The application layer provides user interfaces and visualization tools. The business layer converts technical capabilities into actionable business outcomes. Part […]

Filed Under: FAQ, Featured, IoT Tagged With: FAQ

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