MicroSys Electronics officially announced support for the new NXP Semiconductors S32G3 vehicle network processor at embedded world 2022 (booth 4-108), thereby extending the scalability of the NXP S32G-based miriac System-on-Modules family with massively higher real-time data processing power for mixed-critical safety applications. The new miriac MPX-S32G399A System-on-Module surpasses its NXP S32G2-based predecessor with 2.5 times […]
Connectivity
On-device platform works with IoT modules, plug-and-play IoT devices
MicroEJ announces the availability of its standard Virtual Execution Environment, MICROEJ VEE, for Thales Cinterion IoT Module and Plug and Play IoT Device portfolio. The partnership strategically aligns both companies’ business models to offer flexible application management, increase security by design at the software level, simplify and streamline development, and accelerate time-to-production in markets such as energy, […]
SoM combines multi-core processor with Wi-Fi 5, Bluetooth 5
Laird Connectivity announced the launch of the newest addition to their system-on-module (SOM) portfolio, the Summit SOM 8M Plus. This new SOM is a highly-integrated and comprehensive hardware and software solution that combines NXP Semiconductors multi-core applications processing with dual-band 2×2 Wi-Fi 5 and Bluetooth 5.3 connectivity. The Summit SOM 8M Plus is Laird Connectivity’s most versatile, feature-rich, and […]
BLE MCUs target economical applications
Texas Instruments expanded its connectivity portfolio with a new family of wireless microcontrollers (MCU) that enable high-quality Bluetooth Low Energy (LE) at half the price of competing devices. Featuring best-in-class standby current and radio-frequency (RF) performance, the SimpleLink Bluetooth LE CC2340 family is built on the foundation of TI’s decades of wireless connectivity expertise. Pricing […]
Intelligent Edge Systems feature Intel Xeon D Processors
Super Micro Computer, Inc., a provider of enterprise computing, storage, networking, and green computing technology, announced the global availability of a range of systems for edge computing. This includes the recently announced SuperEdge and a range of Intel Xeon D processor-based systems with up to 20 cores, 25 GbE networking built-in, and a temperature operating […]
Cellular IoT modules integrate iSIM, eSIM technology
Telit, a global enabler of the Internet of Things (IoT), announced it’s broadening its IoT connectivity portfolio with the introduction of Telit NExT Embedded. Employing next-generation integrated SIM (iSIM) and embedded SIM chip (eSIM) technology in the cellular IoT module with an array of intuitive, easy-to-use connection and device management tools, Telit NExT Embedded will materially […]
MCU development kits connect wirelessly with cloud services without a gateway
Two new cloud development kits, CK-RA6M5 and CK-RX65N, provide a complete connectivity solution for the RA and RX Families of 32-bit microcontrollers (MCUs). The cloud kits are the first to be equipped with Renesas’ RYZ014A Cat-M1 module, a certified LTE cellular module that offers the ability to establish wireless connection between MCUs and cloud services […]
SRAM PUF-based security IP protects Intel FPGAs
Intrinsic announced the immediate availability of its SRAM PUF-based hardware IP “QuiddiKey for Intel FPGAs”. QuiddiKey for Intel FPGAs is device-level security IP that comes pre-integrated as part of the security infrastructure of several Intel FPGA families. It creates a more secure platform by providing access to Intrinsic ID’s SRAM PUF technology on the FPGAs. […]
Low-power AI processors support dual-screen displays, small-size HMI apps
Texas Instruments introduced new Sitara AM62 processors that help expand edge artificial intelligence (AI) processing into next-generation applications. The low-power design of the new processors enables support for dual-screen displays and small-size human-machine interface (HMI) applications. Engineers can meet form-factor requirements and deploy smart designs anywhere with power-efficient processors. TI will showcase the new AM62 […]
PCIe 3.0 packet switch addresses fan-out, multi-host connectivity
Diodes Incorporated announced the introduction of a PCIe 3.0 packet switch IC. DIODES PI7C9X3G1632GP provides flexible multi-port and lane width configuration, resulting in elevated levels of performance and availability. This will prove beneficial in systems dealing with AI/deep learning workloads, data storage equipment, the servers in data centers, wireless/wireline telecommunications infrastructure, and various forms of modern […]