The new IQRB-4 bridges the gap between the 12 V powered IQRB-1, IQRB-2, and IQRB-3 and the recently released 3.3 V powered ICPT-1. IQD has been active in the frequency products market for over 45 years and in recent years developed its know-how to specialize in the field of atomic clocks. The company has invested […]
Consumer Electronics
Platform helps build IoT networks
Smart home integration is growing in popularity for many homeowners but is usually only possible with advanced whole-house systems. Quantum Integration’s internet-of-things (IoT) platform provides users complete control; whether novice or expert, anyone can build a powerful IoT network that can control just about anything from simple buttons to complex home integration systems. How is […]
LCDs target stretched, square, round-shaped display needs
DATA MODUL Inc. is expanding its Public Information Display (PID) portfolio by introducing the Tartan LCD display family from AU Optronics (AUO). With this new product family, DATA MODUL Inc. now offers non-standard displays for applications with challenging display requirements and limited advertising space. Thus, the new LCD displays family becomes attractive for public transport, […]
SBCs boast 4K graphics for handling eDP, HDMI, MIPI displays
New Yorker Electronics has introduced the newest line in the Novasom Industries M Series of CPU, the M9. The Novasom M9 joins the well-established M7 and M7Plus Single Board Computers (SBC). Based on the prestigious Rockchip 3399, this CPU offers the new Cortex A72’s performance and the multicore Quad A53. This is used to speed-up […]
Debug interface hardware now available for Linux on ARM
SEGGER’s entire portfolio of J-Link software is now available for Linux on ARM, for both 32-bit and 64-bit platforms. This includes both the command-line programs and GUI tools such as J-Flash, J-Flash SPI, J-Scope, the J-Link Configurator, and the GUI version of the GDB Server. J-Link for Linux on ARM supports the same target devices […]
Eval kit helps wring out single-pair high-speed digital subscriber line apps
With the SHDSL standard, data can be transmitted over extremely long copper cables. This makes this technology the first choice in applications where Power over Ethernet and DSL technologies like G.FAST, VDSL are not possible. With its SHDSL Evaluation Kit, Würth Elektronik now offers developers the possibility to test applications with the SHDSL transceiver from Intel. […]
Free firmware upgrade brings MQTT IIoT support to PLC CPUs
IDEC Corporation has released a free firmware upgrade enabling new and existing MicroSmart FC6A Plus PLC CPUs to support the industry-standard MQTT protocol. The upgrade can be downloaded to the FC6A CPU, so it is easy for users to connect all types of field data to on-site and cloud-based brokers, and make the information readily […]
Low-power MEMS barometric pressure sensor targets drone, IoT apps
TDK Corporation announces the InvenSense ICP-20100 platform, the latest technology advancement in the SmartPressure product family. The ICP-20100 is a barometric pressure sensor based on MEMS capacitive technology, improving our lead in the development of ultra-low noise at the lowest power and progressing our industry-leading relative accuracy, sensor throughput, and temperature stability. The ICP-20100 achieves […]
Low-power microphones inclkude wake-on-sound feature
TDK Corporation introduces the InvenSense T5838, the latest technological breakthrough in the SmartSound product family. The T5838 is the world’s lowest power Pulse Density Modulation (PDM), multi-mode MEMS microphone with high AOP and high SNR for smartphones, microphone arrays, smart speakers, IoT, and other consumer devices. The microphone offers an exceptionally efficient 130 µA ultra-low […]
Next-gen MEMS microphone sports 73 dB SNR, high acoustic overload point
Infineon is launching a next-generation analog MEMS microphone that renders even better results – the XENSIV MEMS microphone IM73A135. In microphones, designers often have to accept trade-offs: high signal-to-noise ratio (SNR), a small package, high acoustic overload point, low power consumption, MEMS versus electret condenser microphones (ECM). For this reason, applications that require the highest […]
