The IRIS-W1 module from u-blox lets IoT devices connect over Wi-Fi and Bluetooth while supporting Thread and Matter protocols. IoT module company u-blox has announced the IRIS-W1, which the company claims is the first stand-alone Wi-Fi module to combine dual-band Wi-Fi 6, Bluetooth LE (Low Energy) 5.3, and Thread including support for Matter protocols. Based […]
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Toolset expanded to enable access to open-source communities
NXP Semiconductors introduced the new MCUXpresso toolset, featuring new tools and resources that empower developers with enhanced scalability, usability, and portability, making it easier and faster to develop complex embedded applications. The new MCUXpresso toolset expands on existing features with new IDE offerings, including a custom-built MCUXpresso extension for Microsoft’s Visual Studio Code (VS Code), […]
Gallery: Cool tech on display at NXP technology days 2022
NXP puts on its technology days event in several cities to familiarize design engineers with trends in new technology and design practices. We got a chance to visit the event in the Detroit area where it had a heavy automotive feel. Though the main focus for the two-day Detroit event was automotive technology, there were […]
Development platform ties automotive gateways to wireless technologies
NXP Semiconductors announced the OrangeBox automotive-grade development platform, which integrates a wide variety of NXP wireless technologies, from broadcast radio, Wi-Fi 6, and Bluetooth, to secure car access with Ultra-Wideband (UWB) and Bluetooth Low Energy (BLE), and 802.11p-based V2X. The OrangeBox is a single, security-enhanced, modular development platform that provides a unified interface between the […]
Automotive radar transceivers feature improved phase noise, output power, noise figure
NXP Semiconductors released its 2nd generation RFCMOS radar transceiver family to production. The TEF82xx is the successor to the market-proven TEF810x, which has already shipped tens of millions of units. Optimized for fast chirp modulation, the device supports short-, medium- and long-range radar applications, including cascaded high-resolution imaging radar. It enables 360-degree sensing for critical […]
Front end modules and drivers address power needs of 5G basestations
NXP Semiconductors has announced its new higher power BTS7202 RX Front End Modules (FEM) and BTS6403/6305pre-drivers for 5G massive multiple-input multiple-output (MIMO) going up to 20 W per channel. Developed and implemented in NXP’s silicon germanium (SiGe) process, the devices operate with modest current consumption to reduce operational costs for mobile network operators (MNOs). They also offer […]
Real-time processor families target software-defined vehicle apps
The S32Z and 532E processor families help enable the automotive industry to accelerate the integration of diverse real-time applications for domain and zonal control, safety processing and vehicle electrification that are critical to the next generation of safer and more efficient vehicles. The S32Z processors are ideal for safety processing and domain and zonal control, […]
MCUs target advanced industrial and IoT edge computing tasks
The new MCX portfolio of microcontrollers is designed to advance innovation in smart homes, smart factories, smart cities and across many emerging industrial and IoT edge applications. The portfolio includes four series of devices built on a common platform and is supported by the widely adopted MCUXpresso suite of development tools and software. This combined […]
DDS connectivity software runs on vehicle network processors
RTI Connext Drive software now runs natively on NXP automotive-grade S32G vehicle network processors, enabling a zonal electrical/electronic (E/E) architecture through a flexible, modular and scalable platform. Connext Drive is RTI’s automotive-grade connectivity software based on the Data Distribution Service (DDS) Standard. Together, the companies aim to accelerate the next-generation of production-track autonomous vehicles. NXP’s […]
i.MX 8M family of chipsets to host digital audio platform
Swedish sound pioneer Dirac and NXP Semiconductors today announced a collaboration to combine one of the world’s most powerful audio chipsets with a market-leading digital audio platform. By equipping the NXP i.MX 8M family of chipsets with Dirac’s digital audio platform, OEMs can enable their devices with maximized, immersive, and adaptive sound across their complete […]
