Mentor, a Siemens business, today announced the availability of automotive-grade automatic test pattern generation (ATPG) technology for its Tessent TestKompress software. The new technology includes a suite of fault models and test pattern generation applications that target defects in ICs at the transistor and interconnect levels – in the process helping customers capture defects that […]
80-MHz Arm Cortex-M4 MCUs include 64Kbyte/128Kbyte Flash, energy management
With a focused feature set and compact package options, STMicroelectronics’ STM32L412 and STM32L422 microcontrollers (MCUs) bring ultra-low power technologies and high performance to budget-conscious consumer, industrial, and medical applications. Whether the squeeze is on core performance, energy, physical space, or bill of materials, the new MCUs give more freedom to beat the constraints. Combining economical 64Kbyte or […]
Vision development kit accelerates ADAS/autonomous system design-through-production
D3 Engineering, a Texas Instruments platinum design partner, announced its DesignCore RVP-TDA2Px Development Kit for autonomous systems development. The production-intent kit features TI’s TDA2Px SoC processor and 4Gbps FPD-Link III SerDes interface. D3 Engineering’s Rugged Vision Platform (RVP) allows rapid technology evaluation and system development under realistic on-vehicle conditions. It accelerates development of Advanced Driver Assistance […]
50 Mp CCD image sensor targets inspection of smartphone displays
ON Semiconductor is enabling more efficient inspection of smartphone displays with the introduction of a new 50 megapixel (MP) resolution charge-coupled device (CCD) image sensor. As the highest resolution Transfer CCD image sensor commercially available, the KAI-50140 provides the critical imaging detail and high image uniformity needed not only for inspection of smartphone displays but also […]
Connected-car automotive MCU enables secure remote updates, high-speed, in-vehicle networking
As critical vehicle powertrain, body, chassis, and infotainment features increasingly become defined by software, securely delivering updates such as fixes and option packs over the air (OTA) enhances cost efficiency and customer convenience. With state-of-the-art security and generous on-chip code storage, ST’s latest Chorus automotive microcontroller is among the industry’s first gateway/domain-controller chips capable of […]
IMU unit boasts 9k-byte FIFO and MIPI I3C serial interface
The LSM6DSO iNEMO Inertial Measurement Unit (IMU) from STMicroelectronics is an always-on 3D accelerometer and 3D gyroscope system-in-package. Two key features play into this increased system-level power efficiency. The LSM6DSO contains a 9k-byte FIFO that can store significantly more data than comparable sensors and, as a result, allows the system processor to wait longer and […]
MCUs supports communication protocol for Robot Operating System
Renesas Electronics Corporation is accelerating the development of robotics systems to deliver intelligence at the industrial endpoint by extending the features of Renesas’ high-performance, 32-bit RX65N Series of microcontrollers (MCUs) to support the DDS-XRCE (Data-Distribution Service for Extremely Resource Constrained Environments), one of the upcoming protocol standards for ROS 2 communication. Renesas’ support of the […]
Security protections added to automotive telematics and connectivity processor
Karamba Security and STMicroelectronics today announced the integration of Karamba’s Carwall end-to-end protection on ST Telemaco3P STA1385 Automotive Telematics and Connectivity Processor. Together, ST and Karamba are leveraging the security architecture of the Telemaco3P with the addition of Carwall Electronic Control Unit (ECU) hardening software. This combined solution provides best-in-class cybersecurity features for both contents and run-time […]
FPGA stretches power limits of wearable and mobile designs
GOWIN Semiconductor Corp.introduces its latest family of small size and low power FPGA products, the GW1NZ “Mobile FPGA”. Using proprietary design techniques and the latest in ultra-low power processes, GOWIN continues to add value to mobile and wearable applications through the development of its innovative FPGA solutions. Today, mobile and wearable applications are pushing the […]
Serial NOR and low-density NAND devices from GigaDevice
GigaDevice’s large range of Serial NOR and low-density NAND products with competitive lead times and pricing is available for immediate shipment globally through Digi-Key Electronics, a global electronic components distributor, as the result of a recent distribution agreement. The GigaDevice product portfolio features a wide variety of NOR Flash densities at 512Kb to 512Mb, with higher […]