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mmWave radar sensors feature one-inch cube form factor

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D3 Engineering announced its DesignCore RS-6843AOP and RS-6843AOPU mmWave Radar Sensors. These miniature sensors enable the implementation of many different mmWave radar algorithms to measure, detect, and track. The production-intent sensors feature a 1-inch cube form factor, heat-spreading metal body, and mounting tabs. They may be used with a PC or embedded platform to facilitate field testing, sensing evaluation, algorithm development, and application demonstrations.

Industrial applications supported by these sensors include robotics, autonomous machines, industrial vehicle systems, and facility monitoring. Specific applications include driver monitoring, collision avoidance, and people counting and tracking. The sensors can also be used in many other use cases with a tethered host processor or stand-alone.

The sensors feature the TI IWR6843AOP, a single-chip 60-GHz industrial radar sensor integrating a DSP, an MCU, radar accelerator as well as an antenna array built right into the package. The IWR6843AOP RF front end integrates a PLL, three transmitters, four receivers, and a baseband ADC. It covers 60 GHz with bandwidths up to 4 GHz and features 12 dBm transmit power and noise figure 15 dB or better across the band. The processing cores in the IWR6843AOP include a C674x DSP for FMCW signal processing, a hardware accelerator for radar cube processing, and a Cortex-R4F microcontroller for object tracking, classification, and communications.

The RS-6843AOP features a header for connection to optional baseboards or hosts providing additional interfaces and functionality. Included on this interface are I2C, SPI, GPIO, and UART connections. On the other hand, the main interface of the RS-6843AOPU version is a USB-C connector which can act as a power supply input as well as enumerating two serial UARTS, one for console and the other for processed radar returns or other algorithm output.

The sensors include custom firmware ensuring board support for the latest version of the SDK from TI.

For additional specifications and drawings download the DesignCore RS-x843AOP/RS-x843AOPU mmWave Radar Sensor Datasheet

The DesignCore RS-6843AOPU mmWave Radar Sensor is $349 and is available for order.

PCB for NVIDIA Jetson Xavier NX module provides 12 camera/sensor inputs

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PCB for NVIDIA Jetson Xavier NXD3 Engineering today announced its new DesignCore Carrier Board, which allows engineers to quickly connect multiple cameras or sensors with the recently launched NVIDIA Jetson Xavier NX module to enable AI at the edge.  

Sensor data is delivered via a serial link and is deserialized into MIPI CSI-2 data for consumption on the Jetson Xavier NX module. This allows the sensors to be placed up to 15 meters away from the processing unit. An on-board FPGA provides hardware-level synchronization capability. 

For additional specifications and drawings download the DesignCore NVIDIA Jetson Xavier NX 12-Camera Carrier Board Data Sheet. 

Customers can purchase the DesignCore Carrier Board for development, or in quantity for ODM production. D3 Engineering provides cameras, radar sensors, and software design examples for use with the carrier board. The company also offers engineering design services to interface other sensors or create new NVIDIA Jetson Xavier NX-based designs to meet customers’ unique requirements.  

 D3 Engineering is a Jetson Preferred Partner for camera development within the NVIDIA Preferred Partner Network. This gives D3 Engineering access to the Jetson camera toolchain, enabling the company to deliver high-performance, cost-optimized embedded vision systems based on the Jetson platform. 

The new DesignCore Carrier Board for NVIDIA Jetson Xavier NX is available for pre-order now. 

Rugged ECU dev kit features SoC processor, configurable SerDes interface

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https://www.d3engineering.com/wp-content/uploads/sites/2/2020/01/D3Eng-DesignCore-TDA4Vx-DevKit-DataSheet.pdfD3 Engineering, a Texas Instruments platinum design partner, announced their DesignCore RVP-TDA4Vx Development Kit with rugged ECU. The DesignCore® RVP-TDA4Vx Rugged ECU accelerates ADAS and autonomous system product design­­­ through production. The production-intent kit features TI’s TDA4VM SoC processor and configurable SerDes interface. The RVP-TDA4Vx Development Kit will be available in 1Q2020.

Automotive applications include automated valet park, deep learning, neural networks, video analytics, object identification and tracking, collision avoidance, driver notification, multi-camera display, mirror replacement, driver and cabin monitoring, sensor fusion, in-vehicle infotainment, and telematics. ­­­­­­­­­­­­­­­

Other applications include autonomous guided vehicles, industrial vehicle systems, high MP cameras, safety and security critical systems, and sensor fusion (camera, radar, ultrasonic, and LIDAR).

The SOM processor board features a TDA4VM SoC processor with internal Image Signal Processor (ISP). The SOM is optimized for automotive temperature ranges and environmental conditions.

The configurable baseboard supports multiple SerDes capture streams with different transport protocols through its configurable personality card. The default card supports eight 4Gbps FPD-LinkTM III channels. The video outputs feature FPD-LinkTM III technology and Display Port MST technology, supporting up to 4 serial displays. The system supports Hardware-in-the-Loop architectures via a CSI2-TX port. The baseboard also has an expansion interface, multiple connectivity options, and an automotive power design with reverse battery protection. The Development Kit ECU has a rugged enclosure for on-vehicle testing. Texas Instruments video from CES 2020

Firmware and software include D3’s advanced vision software framework along with Processor SDK RTOS Automotive (PSDKRA) and Processor SDK Linux Automotive (PSDKLA) from TI. The software packages together form a multi-processor software development platform. The software package provides a comprehensive set of software tools and components to help users develop and deploy their applications. Both PSDKLA and PSDKRA can be used together to implement various automotive use-cases.

Camera/sensor interface cards speeds development on NVIDIA platforms

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DesignCore sensor interface cardD3 Engineering today announced its new DesignCore sensor interface card for the NVIDIA Jetson AGX Xavier Developer Kit. The new card allows engineers to quickly connect multiple cameras or sensors with their NVIDIA Jetson AGX Xavier Developer Kit to access its full power for system development.

D3 Engineering will demonstrate its DesignCore NVIDIA Jetson AGX Xavier FPD-Link III Sensor Interface Card at the GPU Technology Conference (GTC) in San Jose March 18-21, 2019.

Sensor data is delivered via a serial link and is de-serialized into MIPI CSI-2 data for consumption on the Jetson AGX Xavier Developer Kit. This allows the sensors to be placed up to 15 meters away from the processing unit.  GPIO and I2C control are available for configuration and reset.  An on-board FPGA provides hardware-level synchronization capability.

D3 Engineering provides cameras, radar sensors, and software design examples for use with the interface card. The company also offers engineering design services to interface other sensors or create new Jetson AGX Xavier-based designs to meet OEM requirements.

D3 Engineering is an NVIDIA Jetson Preferred Partner for camera development. This partnership provides access to the Jetson camera toolchain, which enables D3 to deliver high-performance, cost-optimized embedded vision systems on the Jetson platform.

The DesignCore NVIDIA Jetson AGX Xavier FPD-Link III Sensor Interface Card will be available April 2019.

Dev kit helps rapidly develop autonomous and deep learning apps

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DesignCore NVIDIA Jetson RSP-TX2 Development KitD3 Engineering, an NVIDIA Jetson Preferred Partner, announces availability of its DesignCore NVIDIA Jetson RSP-TX2 Development Kit for rapid development of autonomous and deep learning applications.

The kit features an NVIDIA Jetson TX2 processor and six high-speed SerDes inputs (FPD-Link III or GMSL2) for vision and spatial sensors.

The kit has Wi-Fi, Bluetooth, Gigabit Ethernet, and USB 3.0 interfaces for control and data offload. It supports two independent HDMI displays. SSD and eSATA expansion enable hours of raw data storage.

The rugged aluminum enclosure and connectors are suitable for deployment in the field. The production-intent design enables faster transition from system design to deployment.

Applications include artificial intelligence at the edge, camera monitoring systems, industrial vehicle systems, machine vision, robotics, and autonomous machines.

Purchase of a D3 Engineering Development Kit conveys a license to use the kit as a platform for technology evaluation and product development. D3 Engineering offers cameras, radar sensors, and software design examples for technology evaluation on NVIDIA Jetson.  D3 Engineering provides concept-to-production embedded product development services, leveraging the RSP-TX2 Development Kit and other DesignCore reference designs. The company sells D3RCM Rugged Camera Modules suitable for both development and production systems.

As an NVIDIA Jetson Preferred Partner for camera development, D3 Engineering accesses the Jetson camera toolchain to develop high-performance, cost-optimized embedded vision systems for its OEM customers.

The DesignCore RSP-TX2 Development Kit is $3,999.

Vision development kit accelerates ADAS/autonomous system design-through-production

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DesignCore RVP-TDA2Px vision development kitD3 Engineering, a Texas Instruments platinum design partner, announced its DesignCore RVP-TDA2Px Development Kit for autonomous systems development. The production-intent kit features TI’s TDA2Px SoC processor and 4Gbps FPD-Link III SerDes interface.

D3 Engineering’s Rugged Vision Platform (RVP) allows rapid technology evaluation and system development under realistic on-vehicle conditions. It accelerates development of Advanced Driver Assistance Systems (ADAS) and autonomous systems, and provides a streamlined path to production.

Automotive applications include camera monitoring systems (CMS) such as multi-camera/multi-display mirror replacement, 3D surround view with car black box, and front or rear cameras with analytics; driver monitoring; stereo vision; sensor fusion (radar, ultrasonic, and LiDAR); and in-vehicle infotainment and telematics.

Other applications include autonomous shipping and transportation, autonomous guided vehicles (AGV), collaborative robotics, and industrial vehicles.

The SOM processor board features a TDA2Px/DRA77xP SoC processor with internal ISP. The SOM layout and BOM are optimized for production.

The customizable baseboard supports eight 4Gps FPD-Link III SerDes capture streams with real-time processing and analytics. Four independent FPD-Link™ III display outputs are 1080p 60fps capable. The baseboard also has an expansion interface and multiple connectivity options. The automotive 9V to 40VDC power input stage has protection to 60VDC and reverse battery protection.

Firmware in the kit includes an advanced vision software framework from D3 Engineering and the Processor SDK-Vision (Vision SDK) software framework from Texas Instruments.

The enclosure is compact and rugged for on-vehicle or field testing. It is designed to support IP64 environmental ratings with a path to IP67.

Purchase of a production-intent DesignCore Development Kit gives users license to evaluate the technology and use it as a platform for product development. D3 Engineering provides embedded system development services based on the development kit and other DesignCore reference designs to help customers speed time to market.

D3 Engineering also provides rugged camera modules for use with the RVP-TDA2Px Development Kit and for ODM use in production systems. D3RCM rugged camera modules are fully-enclosed assemblies designed to IP69K, automotive, and industrial standards. Radar modules are also available for system development.

The RVP-TDA2Px Development Kit is available now through D3 Engineering Design Services. The kits will be available for online purchase in November 2018 for $3,850.

 

Interface card links cameras, other sensors to NVDIA development kits

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interface cardD3 Engineering announces its DesignCore NVIDIA Jetson SerDes Sensor Interface Card for the NVIDIA Jetson Xavier and Jetson TX1/TX2 Developer Kits. Engineers can use the card to easily interface multiple cameras and other sensors to the Jetson platform for realistic benchtop evaluation and rapid proof-of-concept development.

The two most popular SerDes standards are both available on this card: FPD-Link III from Texas Instruments and GMSL2 from Maxim Integrated. Each sensor stream comes in over a serial link and is de-serialized into MIPI CSI-2 data for the Jetson Developer Kit. A MIPI CSI-2 input enables direct connection to the Jetson platform.

GPIO and I2C control are available for configuration, synchronization and reset. The card takes a 12V external supply and has a power-over-coax connection.

Download the SerDes card data sheet for specifications: https://store.d3engineering.com/wp-content/uploads/2018/07/D3Eng-DesignCore-NVIDIA-Jetson-SerDes-DataSheet.pdf

Image gallery: Cool autonomous vehicle tech at TU-Automotive Detroit

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The recently wrapped-up TU-Automotive Detroit conference on autonomous and connected vehicles played host to 150 conference speakers and 3,000 people kicking tires in the 200,000-ft2 exhibition area. In the pages that follow are some of the more interesting technologies we found on display as we roamed the exhibit aisles.

Taking a ride in a robotic vehicle

perrone auto carPerrone Robotics and its current reference vehicle Linc – a 2017 Lincoln MKZ – maneuvered around the parking lot directly across from the show main entrance. Lucky riders got to see Linc perform different maneuvers, run its software on different platforms, and adapt to obstacles. Perrone makes a software platform for robotic vehicles called Max which puts services for different kinds of functions in different layers so they, presumably, don’t interfere with one another.

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