Nebula Systems has released the NC1701, a dedicated vehicle communications chip solution capable of extracting OEM data from any vehicle. It can be embedded into any telematic device and has been designed from the ground up with a focus on telematic applications.NC1701 is a standalone microcontroller that can be incorporated into telematic hardware designs, either […]
Automotive
Gallery: Scenes at the Mentor Graphics Integrated Electrical Solutions Forum
The Mentor IESF recently took place in Plymouth, Mich. and featured a heavy dose of technology built around autonomous vehicle and connected vehicle themes. Here are a few of the more interesting sights we discovered as we perused the technical sessions and the show floor. NEXT PAGE :Two displays, one computing platform
GNSS boards provide positioning and orientation data
Trimble introduced a new family of Trimble BD GNSS boards for high-precision guidance and control applications. The BD boards’ simple connectivity and configuration allow system integrators and OEMs to easily add GNSS positioning and orientation—with the ability to upgrade its capabilities—using the same board footprint, connectors and software interface for specialized and custom hardware solutions. […]
Chip IP helps implement advanced infotainment, ADAS SoCs in 16-nm FinFET Compact technology
Cadence Design Systems, Inc. today announced it is delivering a comprehensive automotive IP portfolio for the TSMC 16nm FinFET Compact (16FFC) automotive process technology. This broad IP portfolio enables a host of applications ranging from in-vehicle infotainment, in-cabin electronics, vision subsystems, digital noise reduction and advanced driver assistance system (ADAS) subsystems and is registered in […]
Vehicle-to-Everything chipset encompasses direct- and network-based communications
Qualcomm Technologies, Inc. introduced its first-announced Cellular Vehicle-to-Everything (C-V2X) commercial solution based on 3rd Generation Partnership Project (3GPP) Release 14 specifications for PC5-based direct communications, the Qualcomm 9150 C-V2X chipset. To meet automaker production demands for road safety using C-V2X solutions, the chipset is anticipated to be available for commercial sampling in the second half of 2018. […]
AP circuits for V2X vehicular apps with HCI and HSM module combination
LG Innotek today announced it developed the world’s first ‘Second Generation V2X Full Module’ geared for the connected cars and autonomous vehicles. In addition to having the wireless communication ability sufficient for commercialization, this device can be equipped into any part of a vehicle thanks to its excellent durability and minimized size, enhanced from the […]
3D camera module delivers real-time depth sensing, 3D point cloud generation
Qualcomm Incorporated and its subsidiary Qualcomm Technologies, Inc., and Himax Technologies, Inc. , today jointly announced a collaboration to accelerate the development and commercialization of a high resolution, low power active 3D depth sensing camera system to enable computer vision capabilities for use cases such as biometric face authentication, 3D reconstruction, and scene perception for […]
Fast serial interface RAM targets high-performance apps
Professional low power memory solution Fabless company JSC announced the industry’s fastest Octa serial interface RAM, the OctaRAM JSC64SS product family. OctaRAM provides designers with the next generation performance level of x8 I/O serial interface products with an operating frequency of up to 200MHz and transmission speeds of up to 400MB/s. This world class leading performance […]
AM/FM receivers, digital radio tuners meet vehicle quality standards
Silicon Labs has introduced the industry’s most scalable, flexible and cost-effective car radio solution for the global automotive infotainment market. Silicon Labs’ new portfolio of Global Eagle and Dual Eagle AM/FM receivers and digital radio tuners and Digital Falcon coprocessors enables automakers and Tier 1 suppliers to address all market segments, cost and performance levels, and […]
SSD controllers support latest 3D NAND devices
Silicon Motion Technology Corporation announced the availability of the industry’s broadest portfolio of merchant turnkey SSD (solid state disk) controllers, including the new ultra-high speed SM2262EN and SM2262 for client, the SM2263 for mainstream and the SM2263XT DRAM-less controller, which supports the BGA form factor. With the new SM2262 and SM2263 series, Silicon Motion provides […]