STMicroelectronics has extended its STM32WB* Bluetooth LE microcontroller (MCU) offering with new devices that combine entry-level features with extra power savings for longer-lasting performance. The dual-core STM32WB15 and STM32WB10 Value Line pair an Arm Cortex-M4 processor to run the main application and a Cortex-M0+ to handle Bluetooth 5.2 connectivity, ensuring real-time performance from each. The radio stage has a 102dBm link […]
IoT
Miniaturized Wi-Fi and BLE wireless modules feature low power consumption
InnoPhase announces the new Talaria TWO INP1012 and INP1013 modules for a wide range of products including smart home, smart industry, and smart health applications. The platform combines wireless connectivity and an integrated microcontroller for edge-of-network IoT devices that require low power consumption and a direct-to-cloud connection. The miniaturized modules are forty percent smaller than the […]
Tiny LoRaWAN modem module excels at low current consumption
Murata announced the expansion of its Type 1SJ product line with the addition of a new LoRaWAN modem solution. The AT-command controlled modem module version measures only 10.0 mm x 8.0 mm x 1.6 mm, making it the smallest available in the world today. Operating from a single supply rail up to 3.9V DC, the […]
Computer-on-module HPC board features 11th gen Intel core processor
Congatec presents a brand new COM-HPC starter set at embedded world 2021 DIGITAL. Ideal for modular system designs utilizing the latest high-speed interface technologies such as PCIe Gen4, USB 4.0, and up to ultra-fast 2×25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel […]
Industrial-rated carrier provides extensive connectivity for Type 10 mini-module designs
WINSYSTEMS today introduced its first Mini-ITX form factor carrier board to complement and support its COMeT10-3900 COM Express Type 10 mini modules. The ITX-M-CC452-T10 carrier platform is designed with industrial components for testing products in development and to deliver highly reliable performance in operating environments with temperatures of -40°C to +85C°. WINSYSTEMS’s newest COM Express market entry offers the assurance […]
Applications processor enables ultra-low power processing and trusted cloud-to-edge security
NXP Semiconductors N.V. today announces the expansion of its EdgeVerse portfolio with its crossover applications processors, including i.MX 8ULP and i.MX 8ULP-CS (cloud secured) Microsoft Azure Sphere-certified families, as well as next-generation i.MX 9 series of high performance intelligent applications processors. The expansion includes new innovations with EdgeLock secure enclave to enhance edge security and […]
Optimized 32-bit MCU targets IoT edge applications
Silicon Labs announced the launch of the EFM32PG22 (PG22) 32-bit microcontroller unit (MCU), a low-cost, high-performance solution with an industry-leading combination of energy efficiency, performance, and security. With easy-to-use, cost-efficient analog capabilities, the PG22 MCU is ideally suited for the rapid development of consumer and industrial applications with demanding size constraints and low-power operation requirements. […]
WiFi 6/6E and Bluetooth 5.2 SoCs available as 1×1 and 2×2 devices
Infineon Technologies AG is expanding its wireless portfolio of high-performance, reliable and secure offerings. The newly developed AIROC brand now includes the industry’s first 1×1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for the IoT, enterprise, and industrial applications, and its first 2×2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer, and automotive […]
Development platform delivers smartphone-like UX on low-power hardware
Crank Software continues to innovate with the launch of Storyboard 7.0, a development platform built to deliver smartphone-like user experiences (UX) on low-power, tightly-resourced hardware. With increasing consumer expectations and the number of IoT-connected devices projected to increase to 43 billion worldwide by 2023, Storyboard’s new Rapid Design Import and Iteration Technology meet the needs […]
Shot camera, sensor development kits get middleware support for global public clouds
ON Semiconductor has announced that the RSL10 Smart Shot Camera and the RSL10 Sensor Development Kit have been pre-integrated within the Bosch IoT Suite, the Bosch Group’s core software platform and core software ecosystem for the Internet of Things (IoT). The RSL10 Smart Shot Camera and the RSL10 Sensor Development Kit are complete node-to-cloud solutions […]