Designers can extract vital signs and raw data for their wearable designs with the MAX-HEALTH-BAND, as well as monitor clinical-grade electrocardiograph (ECG) and heart rate with the MAX-ECG-MONITOR from Maxim Integrated Products, Inc. The MAX-HEALTH-BAND evaluation and development platform, a wrist-worn heart-rate and activity monitor, features the MAX86140 optimized optical pulse-oximeter/heart-rate sensor, the MAX20303 wearable power-management solution, and Maxim’s motion-compensated algorithms. The MAX-ECG-MONITOR evaluation […]
Applications
SoC cores handle AI acceleration and DSP tasks
Today General Processor Technologies, China’s licensor of customizable processor IP cores, announced two innovative new additions to its IP portfolio: the ‘GPT’ AI accelerator and the VLVm1 Digital Signal Processor (DSP) for digital and image processing. With the new cores, designers can reduce chip cost, area, and power consumption in SoCs targeting applications across autonomous vehicles and […]
Image recognition SoC integrates four 2-GHz cores
Optimum Semiconductor Technologies, Inc. announced the GP8300 image recognition SoC. The GP8300 dramatically reduces chip cost, area, and power consumption for image recognition and object detection in a broad range of products such as self-driving cars, autonomous vehicles, smart cameras and other IoT edge devices. Created in 28nm technology, the GP8300 includes four 2GHz ‘Unity’ CPU […]
Dual-core digital signal controller
System developers designing high-end embedded control applications can benefit from a new Digital Signal Controller (DSC) with two dsPIC DSC cores in a single chip, now available from Microchip Technology Inc. The dsPIC33CH has one core that is designed to function as a master while the other is designed as a slave. The slave core is useful for […]
Standard provides industry-accepted framework to enable performance and security while accelerating innovation and market growth in IoT, 5G and AI
The OpenFog Consortium’s OpenFog Reference Architecture for fog computing has been adopted as an official standard by the IEEE Standards Association (IEEE-SA). The new standard, known as IEEE 1934, relies on the reference architecture as a universal technical framework that enables the data-intensive requirements of the Internet of Things (IoT), 5G and artificial intelligence (AI) applications. “We now have […]
Low-power Wi-SUN-compatible sensor nodes draw just 1 mA when sensing
Eta Compute Inc., a company focused on delivering next-generation autonomous intelligence to mobile and edge devices, and ROHM Semiconductor announced their collaboration to develop unprecedented low power Wireless Smart Ubiquitous Network (Wi-SUN) compatible sensor nodes. The nodes will combine ROHM’s sensor technology and Eta Compute’s low power MCUs to deliver one of the highest performing, lowest power […]
eSIM chip loading with connection credentials
STMicroelectronics is now the first embedded SIM (eSIM) manufacturer to be accredited by the GSMA for loading eSIM chips with connection credentials such as certificates and operator profiles before shipping. The eSIMs, customized with connection credentials, enable smaller form factors, greater security, and increased flexibility. Chip-scale, permanently embedded, and electronically reprogrammable, eSIMs save space inside smartphones […]
Clock generators, jitter attenuators, VCXO/XOs target latest 56G SerDes-based communications
The Silicon Labs Si5391 is said to be the industry’s lowest jitter, any-frequency clock generator. It can provide all clock frequencies needed in 200/400/600G designs from a single IC while delivering sub-100 fsec RMS phase jitter performance for 56G SerDes reference clocks. Featuring up to 12 differential outputs, the Si5391 clock is available in frequency […]
Tunnel magnetoresistance angle sensor for vehicular use supports ASIL-D safety standard
Infineon Technologies AG is launching its first magnetic sensors based on TMR technology. This makes the company the world’s first sensor manufacturer to offer magnetic sensors based on all four magnetic technologies: HALL, GMR, AMR and TMR. Infineon will present the new XENSIV™ TLE5501 angle sensor family at the Sensor+Test 2018 fair in Nuremberg (26-28 […]
SoC design software runs analysis of peak power use
Synopsys, Inc. today introduced PrimePower, an expanded power analysis solution created to accelerate system-on-chip (SoC) design closure by extending signoff power analysis to drive early design implementation and accurate reliability analysis. Revolutionary technologies based on Synopsys’ golden PrimeTime static timing analysis and signoff empower designers to perform faster and uniquely accurate power analysis and power-driven optimizations […]