Kontron launches a new 3.5″ single-board computer, named 3.5″-SBC-TGL, powered by 11th Generation Intel Core U-Series and Celeron 6000 Series processors (Code Name: Tiger Lake UP3), to help system developers build a low-latency, graphics-demanding, and AI-enabled embedded system for smart retail, industrial automation, smart city, healthcare or similar IoT / AIoT related applications. Besides the […]
Applications
Automotive-qualified GNSS module is IMU-software combo
To support the positioning market with state-of-the-art GNSS chipset and modules, STMicroelectronics has introduced the Teseo-VIC3DA, the latest member of the Teseo module family. Teseo-VIC3DA combines ST’s high-performing Automotive Teseo III GNSS IC with the automotive 6-axis MEMS inertial measurement unit (IMU) and dead reckoning software to create a convenient, automotive-qualified navigation module. Leveraging ST’s in-house manufacturing […]
Cloud service automates IoT device connection/registration via X.509 device certificates
Infineon Technologies AG launched CIRRENT Cloud ID, a service that automates cloud certificate provisioning and IoT device-to-cloud authentication. The easy-to-use service extends the chain of trust and makes tasks easier and more secure from chip-to-cloud while lowering companies’ total cost of ownership. Cloud ID is ideal for cloud-connected product companies in the industrial, consumer, healthcare, […]
Rugged 3U OpenVPX processor module provides hardware-accelerated graphics
Curtiss-Wright’s Defense Solutions has announced the latest addition to its portfolio of DO-254 / DO-178C safety certifiable commercial off the shelf (COTS) products with the introduction of the V3-717, a rugged 3U OpenVPX high-performance graphics processor module. Expanding Curtiss-Wright’s support for the modular open system approach (MOSA), the V3-717 adds hardware-accelerated graphics with video encode/decode hardware acceleration […]
Wireless MCUs support latest BLE 5.3 Spec
Renesas Electronics Corporation announced that it is developing new microcontrollers (MCUs) that will support the recently released Bluetooth 5.3 Low Energy (LE) Specification. The new devices will be part of the Renesas Advanced (RA) Family of 32-bit Arm Cortex-M microcontrollers, joining the RA4W1 Bluetooth 5.0 LE device introduced last year. Renesas expects to have the […]
Tool suite works with open-source automation servers
LDRA announced a plug-in that brings the capabilities of the LDRA tool suite into the Jenkins automation server for continuous integration (CI) for agile software development. Jenkins automates and manages the build process and connects build and version control systems with quality management and automated testing processes for large-scale system-level software projects. LDRA has long […]
Large-format holographic touch screens target industrial apps
Holo Industries LLC has expanded its line of Holographic TouchTM solutions to include large-format, contactless holographic systems for machines, factories, and other rugged industrial applications. The holographic image is clear and precise, and Holo’s user interface (UI), is accurate and responsive, providing zero latency with an impressive 50 millisecond response time, even when the operator […]
Infineon’s OktoberTech 2021 goes virtual October 21
Infineon Technologies’ annual half-day business and technology briefing, OktoberTech2021, goes virtual this year and with a first-ever look into the combined technologies of Infineon and Cypress, a strong portfolio of product and system solutions for the world’s next innovations. In addition to keynote and technical presentation, the on-demand, virtual, half-day event will highlight advanced technologies. […]
MCU specification considerations for robotics
Robotics platforms have unique needs where microcontroller (MCU) performance is concerned. MCUs that have been optimized for use in robots often incorporate multiple functions, including built-in internet protocol (IP) connectivity, safety and security functions, and advanced control algorithms. Integrating an MCU core with a field programmable gate array (FPGA) is another approach to achieving optimized […]
ISO 26262 functional safety packages accelerate development of DSC, MCU ASIL B/C safety level designs
Safety is a primary concern in automotive applications to ensure reliable operation and end users’ wellbeing. Microchip Technology Inc. is offering newly certified functional safety packages to enable engineers to develop their products as per the ISO 26262 functional safety standard. Microchip is announcing the release of ISO 26262 functional safety packages for dsPIC33C digital signal […]