MediaTek unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera, and multimedia features for powerful 5G experiences. The addition of the 6nm Dimensity 1200 and 1100 chipsets to MediaTek’s 5G portfolio gives device makers a growing suite of options to design highly capable 5G smartphones with top of the line […]
Hardware
High-temperature EEPROMs reduce initial data writing time by 30%
New 125°C operation-compatible I2C bus EEPROMs, BR24H-5AC series, targets applications that require data storage under harsh environments, such as factory settings for onboard cameras and sensors, airbag operating history, and data logging for always-on operating industrial automation systems and servers. The BR24H-5AC series of 125°C operation-compatible EEPROMs is the first in the industry to achieve […]
Smartphone image sensors combine 1-micron pixels, ultra-high gain, multi-sampling de-noise
OmniVision Technologies, Inc. announced in advance of CES the OV40A, a 40MP, 1.0-micron pixel image sensor that features super high gain and de-noise technologies for the best-in-class low light camera performance in the 1/1.7” optical format. This sensor also offers multiple high dynamic range (HDR) options for the best quality still and video captures. Additionally, it supports 1080p slow-motion and high-speed video captures at […]
LTE Cat 1 chip platform handles VoLTE/100 kbps IoT apps
Sequans Communications S.A. announced that its second-generation LTE Cat 1 chip platform, Calliope 2, will soon be sampling. Calliope 2 is designed for the cost-effective support of IoT applications that require VoLTE and a data rate higher than 100 kilobits per second that cannot be supported by LTE-M or NB-IoT technologies. Typical Calliope 2 applications […]
Bluetooth LE/802.15.4 wireless modules incorporate STM32 MCUs
STMicroelectronics is offering a solution to accelerate the market introduction of new Bluetooth LE and 802.15.4 based IoT devices with a miniature, ready-to-use STM32 wireless microcontroller (MCU) module. The 7mm x 11.3mm STM32WB5MMG module lets product teams build connected devices without needing wireless-design skills. Made to enable low-cost PCB technology requiring a minimal number of layers, it integrates everything […]
Open-source IoT middleware platform improves data tagging, customized editing features
EdgeX Foundry announced the “Hanoi” release that makes IoT deployment easier and the launch of new ecosystem resources. Launched in April 2017, and now part of the LF Edge umbrella, EdgeX Foundry is an open-source, loosely-coupled microservices framework that provides the choice to plug and play from a growing ecosystem of available third-party offerings or to augment proprietary […]
IoT module hosts LTE-optimized transceiver, SIM card, includes data plan
Sequans Communications S.A. introduced an LTE IoT module that offers device makers a quick and easy solution for connecting their IoT devices to the Orange LTE-M Network. The Monarch GMS01Q module, a third-generation module from the Orange Live Booster program, is based on Sequans’ industry-leading Monarch LTE-M/NB-IoT chip platform and includes an LTE-optimized transceiver and […]
Open standard module release defines postage-stamp-sized computer PCBs
SGET e.V. announces release 1.0 of the new OSM Computer-on-Module standard. OSM, which is short for Open Standard Module, defines one of the first standards for directly solderable and scalable embedded computer modules. It also marks a new milestone in the miniaturization of modular COM/carrier designs, replacing credit card-sized modules with postage-stamp-sized ones. The new […]
SSDs with 3D NAND flash memory support serial ATA
TDK Corporation announces a new generation of flash storage products with five series, available December 2020, optimized for industrial, medical, art grid, transportation, and security applications. All five series use GBDriver GS2, TDK’s proprietary NAND flash memory control IC, which supports serial ATA. As 3D flash memory technology advances, flash storage solutions with capacities over […]
MCUs feature cap-touch sensing, low power consumption for HMI-based IoT apps
Renesas Electronics Corporation announced the expansion of its 32-bit RA2 Series microcontrollers (MCUs) with 20 new RA2L1 Group MCUs, increasing the RA Family to 66 MCUs. The general-purpose RA2L1 MCUs use the Arm Cortex-M23 core operating up to 48 MHz. The RA2L1 MCUs are supported by the easy-to-use Flexible Software Package (FSP) and Renesas’ partner ecosystem, […]
