Renesas Electronics Corporation announced its collaboration with Microsoft to accelerate the development of connected vehicles. Renesas’ R-Car Starter Kit, based on Renesas’ R-Car automotive system-on-chip (SoC), is now available as a development environment for the Microsoft Connected Vehicle Platform (MCVP)<https://www.microsoft.com/industry/automotive/connected-vehicles>. MCVP combines a partner ecosystem with a horizontal platform of Azure cloud, AI, and edge […]
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Low-power microphones inclkude wake-on-sound feature
TDK Corporation introduces the InvenSense T5838, the latest technological breakthrough in the SmartSound product family. The T5838 is the world’s lowest power Pulse Density Modulation (PDM), multi-mode MEMS microphone with high AOP and high SNR for smartphones, microphone arrays, smart speakers, IoT, and other consumer devices. The microphone offers an exceptionally efficient 130 µA ultra-low […]
ASIL-rate IMU optimized for autonomous vehicle apps
TDK Corporation announces the availability of the InvenSense IAM-20685, the latest release in the SmartAutomotive product family. The IAM-20686 is a new ASIL-B monolithic 6-axis MEMS IMU developed in compliance with ISO 26262. Taking advantage of TDK’s proprietary MEMS fabrication platform and technology, the IAM-20685 features a highly integrated single-chip 6-axis MEMS gyroscope and accelerometer […]
Neural net ICs target audio and sensor processing apps
Syntiant Corp. announced the availability of its Syntiant NDP120 Neural Decision Processor (NDP), the latest generation of special-purpose chips for audio and sensor processing for always-on applications in battery-powered devices. The NDP120 applies neural processing to run multiple applications simultaneously with minimal battery power consumption, including echo-cancellation, beamforming, noise suppression, speech enhancement, speaker identification, keyword […]
Smartphone image sensors combine 1-micron pixels, ultra-high gain, multi-sampling de-noise
OmniVision Technologies, Inc. announced in advance of CES the OV40A, a 40MP, 1.0-micron pixel image sensor that features super high gain and de-noise technologies for the best-in-class low light camera performance in the 1/1.7” optical format. This sensor also offers multiple high dynamic range (HDR) options for the best quality still and video captures. Additionally, it supports 1080p slow-motion and high-speed video captures at […]
Flash programmer gets quad-mode capability for QSPI flashes
SEGGER adds quad mode programming for QSPI Flashes to its universal flash programmer, maximizing programming speed for production environments. Flasher PRO ensures that the time gained using 4-pin transfer translates directly to increased productivity. Operating in either PC-based or stand-alone mode, the Flasher PRO reaches the theoretical minimum programming time of the QSPI device itself. […]
LTE Cat 1 chip platform handles VoLTE/100 kbps IoT apps
Sequans Communications S.A. announced that its second-generation LTE Cat 1 chip platform, Calliope 2, will soon be sampling. Calliope 2 is designed for the cost-effective support of IoT applications that require VoLTE and a data rate higher than 100 kilobits per second that cannot be supported by LTE-M or NB-IoT technologies. Typical Calliope 2 applications […]
Bluetooth LE/802.15.4 wireless modules incorporate STM32 MCUs
STMicroelectronics is offering a solution to accelerate the market introduction of new Bluetooth LE and 802.15.4 based IoT devices with a miniature, ready-to-use STM32 wireless microcontroller (MCU) module. The 7mm x 11.3mm STM32WB5MMG module lets product teams build connected devices without needing wireless-design skills. Made to enable low-cost PCB technology requiring a minimal number of layers, it integrates everything […]
DDS connectivity software runs on vehicle network processors
RTI Connext Drive software now runs natively on NXP automotive-grade S32G vehicle network processors, enabling a zonal electrical/electronic (E/E) architecture through a flexible, modular and scalable platform. Connext Drive is RTI’s automotive-grade connectivity software based on the Data Distribution Service (DDS) Standard. Together, the companies aim to accelerate the next-generation of production-track autonomous vehicles. NXP’s […]
ASICs optimized for entry-level, stand-alone driver monitoring systems
OmniVision Technologies, Inc. announced in advance of CES the OAX8000 AI-enabled, automotive application-specific integrated circuit (ASIC), which is optimized for entry-level, stand-alone driver monitoring systems (DMS). The OAX8000 uses a stacked-die architecture to provide the industry’s only DMS processor with on-chip DDR3 SDRAM memory (1GB). This is also the only dedicated DMS processor to integrate a neural processing […]