Due to the rise of in-vehicle network connections like Bluetooth and LTE/5G, today’s vehicles host more vulnerabilities than ever before, driving new cybersecurity regulations and specifications for the automotive market. Helping OEMs and their module suppliers simplify the upgrade of existing designs to meet security requirements for future generations, Microchip Technology Inc. announced its CryptoAutomotive security […]
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COM-HPC carrier board includes interfaces for programming, firmware flashing, reset
Congatec introduces the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilization of congatec’s COM-HPC modules based on the latest 11th Gen Intel Core processors (code name […]
AMD Ryzen embedded V2000 CPUs now on COM express modules
Congatec significantly broadens the application areas of its AMD Ryzen Embedded processor-based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched on the COM Express Compact footprint. The new congatec conga-TCV2 powered by the new Ryzen Embedded V2000 processor impresses with […]
Dev kit speeds industrial Ethernet comm projects for CC-Link IE TSN systems
IAR Systems announces the availability of the new evaluation kit IAR KickStart Kit for Renesas’ R-IN32M4-CL3, assisting developers in the development and evaluation of R-IN32M4-CL3 IC for industrial Ethernet communication which supports CC-Link IE TSN targeted for smart factory applications. The CC-Link IE TSN is an open Industrial Ethernet (IE) technology from CC-Link Partner Association. […]
Bidirectional level translator connects SD 3.0 memory with low-voltage processing hardware
Diodes Incorporated announced the PI4ULS3V4857, an SD 3.0-compliant bidirectional level translator for use in communication, consumer, and computing system applications including smartphone handsets, notebooks, SD/MicroSD card readers, wireless access points, and 5G femtocells. The PI4ULS3V4857 has the capacity to translate a 1.2V to 1.8V host side voltage into a memory card voltage signal of either […]
MCUs simplify and accelerate automotive software development
NXP Semiconductors N.V. announced the S32K3 microcontroller (MCU) family, the newest addition to its S32K product line. The S32K1 family, released in 2017, marked an important turning point in addressing software’s central role in automotive development. The new S32K3 family, designed for automotive body electronics, battery management, and emerging zone controllers, continues to simplify software […]
Economical desktop computer based on Raspberry Pi
Newark announced the availability of the new-to-market Raspberry Pi 400 desktop computer. Available in ready-to-use kit form, the competitively priced Raspberry Pi 400 is an ideal desktop computer for use in the home or education. Raspberry Pi 400 can also be purchased on its own for use in industrial and commercial applications including point-of-sale terminals and thin […]
Tiny, dual-antenna GPS/GNSS module provides accurate positioning and heading
Septentrio expands its GNSS module portfolio with a mosaic-H heading receiver. With dual antenna capabilities, this surface mount module delivers reliable heading & pitch or heading & roll information on top of centimeter-level positioning. mosaic-H is the new addition to Septentrio’s existing mosaic module family, which already includes high-performance RTK and timing modules as well […]
Open VPX backplanes designed for horizontal- mount enclosures
Pixus Technologies has announced new OpenVPX backplanes designed for horizontal-mount enclosures. The horizontal-mount backplanes can be placed into 1U-4U tall 19” rackmount OpenVPX enclosures. They provide enough space to have three 3U slots or one 3U and one 6U slot side-by-side. So, a wide range of configurations and size options are available. The backplanes are […]
PCIe boards carry accelerator ICs to speed AI inference for edge systems
Flex Logix Technologies, Inc. announced the availability and roadmap of PCIe boards powered by the Flex Logix InferX X1 accelerator – the industry’s fastest and most efficient AI inference chip for edge systems. The InferX X1P1 uses a single InferX X1 chip and a single LPDDR4x DRAM on a half-height, half-length PCIe board. Samples are […]