Embedded developers can now use SEGGER Embedded Studio IDE with the Renesas RE Family of microcontrollers (MCUs). Embedded Studio is SEGGER’s cross-platform integrated development environment (IDE) for embedded systems development. The editor is quick to start up and the build process is blazingly fast, saving precious working hours. Embedded Studio contains SEGGER’s own runtime and […]
Memory
nvSRAM qualified to QML-Q and high-reliability industrial specifications
Infineon Technologies LLC announced the availability of its second-generation non-volatile Static RAMs (nvSRAM). The new generation of devices are qualified for QML-Q and high-reliability industrial specifications to support demanding non-volatile code storage and data-logging applications in harsh environments, including aerospace and industrial applications. The 256 kb STK14C88C and 1 Mb STK14CA8C nvSRAMs are qualified in […]
DDR5 memory boasts improved concurrency, built-in ECC
Longsys Electronics launches the Longsys DDR5 memory module (ES1). The company has done so in order to keep up with the development of storage technologies, to meet expectations from industry professionals and users regarding future product technology development, and to provide more possibilities for the future of storage industry applications. Moreover, Longsys’ FORESEE, a technical storage […]
Low-power memory qualified for automotive safety applications
The industry’s first automotive low-power DDR5 DRAM (LPDDR5) memory is hardware-evaluated to meet the most stringent Automotive Safety Integrity Level (ASIL), ASIL D. The solution is part of Micron’s new portfolio of memory and storage products targeted for automotive functional safety based on the International Organization for Standardization (ISO) 26262 standard. Micron’s functional safety-evaluated DRAM […]
3D flash memory features low read latency, fast I/O
Kioxia Corporation and Western Digital Corp. announced that the companies have developed their sixth-generation, 162-layer 3D flash memory technology. Marking the next milestone in the companies’ 20-year joint-venture partnership, this is the companies’ highest density and most advanced 3D flash memory technology to date, utilizing a wide range of technology and manufacturing innovations. This sixth-generation […]
Evaluation kit checks out ultra-low power e-paper displays
Pervasive Displays has introduced the EXT3 extension kit and evaluation board, with support for its entire range of iTC ultra-low-power e-paper displays for industrial, commercial, and retail applications, along with extensive software libraries to help reduce its customers’ engineering effort. Many manufacturers are looking to move away from TN/STN displays to an ultra-low power e-paper […]
1α DRAM node enables more power-efficient and reliable memory designs
Micron Technology, Inc. announced volume shipment of 1α (1-alpha) node DRAM products built using the world’s most advanced DRAM process technology and offering major improvements in bit density, power, and performance. This milestone reinforces Micron’s competitive strength and complements its recent breakthroughs with the world’s fastest graphics memory and the first-to-ship 176-layer NAND. Micron plans […]
176-layer, 4D NAND flash improves bit productivity
SK Hynix Inc. announced the completion of developing the industry’s most multilayered 176-layer 512 Gigabit (Gb) Triple-Level Cell (TLC) 4D NAND flash. The Company provided the samples to controller companies last month to make a solution product. SK Hynix has been promoting 4D technology from the 96-layer NAND flash products that combine Charge Trap Flash […]
MCUs target IoT apps, consume uA/MHz in active mode, 1.6 mA in standby mode
Renesas Electronics Corporation expanded its RA4 Series microcontrollers (MCUs) with the new 32-bit RA4M3 Group of MCUs. The RA4M3 MCUs boost operating performance up to 100 MHz using the Arm Cortex-M33 core based on Armv8-M architecture. Featuring industry-leading performance, Arm TrustZone technology, Renesas’ Secure Crypto Engine, and a suite of new memory enhancements, the RA4M3 Group […]
SSDs with 3D NAND flash memory support serial ATA
TDK Corporation announces a new generation of flash storage products with five series, available December 2020, optimized for industrial, medical, art grid, transportation, and security applications. All five series use GBDriver GS2, TDK’s proprietary NAND flash memory control IC, which supports serial ATA. As 3D flash memory technology advances, flash storage solutions with capacities over […]