Saelig Company, Inc. has introduced the 18EQHM32 series of oscillators that can reduce overall EMI issues in electronic equipment by subtly varying the system clock oscillator center frequency and thus distributing any EMI issues over a broader bandwidth. The new 18EQHM32 series are designed as drop-in replacements for standard clock oscillators and are targeted for […]
Tools
SDK handles eSync over-the-air platform projects
The eSync Alliance announces the launch of its eSync Agent SDK, a new Software Development Kit (SDK) for the eSync Over-The-Air (OTA) platform. This new SDK makes it simpler and quicker to integrate electronic control units (ECUs), smart sensors, and other edge devices in a vehicle with the eSync OTA data pipeline, thereby enabling automotive […]
COMs carry Intel Core, Xeon and Celeron 6000 processors
ADLINK Technology Inc. introduces its new Express-TL COM Express Type 6 module with Intel Core, Xeon W, and Celeron 6000 processors and octa-core (8-core) performance. Intel UHD Graphics and Intel AVX-512 VNNI provide superior artificial intelligence (AI) inferencing performance. The Express-TL is well-suited for image processing and analysis, high-speed video encoding and streaming, medical ultrasound, […]
IDE targets Linux application developers
Linux Studio is a development environment designed specifically for native host development, making the features of SEGGER’s top-rated Embedded Studio IDE available to all Linux application developers. With its sleek Visual Studio-style user interface, powerful project management, and integrated source-level debugger, Linux Studio greatly simplifies development on Linux. Linux Studio’s project manager enables the clear […]
AIoT platform carries Intel 10th-Ge Xeon W and Core i7/i5/i3 processors
ASRock Industrial Computer is releasing the new iEPF-9000S Series/ iEP-9000E Series Ruggedized Edge AIoT Platform powered by Intel 10th Generation Xeon W and Core i7/i5/i3 Processors (Comet Lake) with W480E, Q470E, and H420E chipsets for supreme performance, flexible integration, and reliable durability at the Edge. Featuring workload consolidation, the new Series provides supercomputing power, rich I/Os, […]
Evaluation board works with latest-generation USB power delivery ICs
8FTDI Chip has announced a new development board based on its FT4233HP multi-channel interface ICs. The new FT4233HP high-speed USB serial/FIFO evaluation board will enable engineers to get started much quicker on implementing USB power delivery arrangements. This could be for the retrofitting of this functionality into legacy designs that are already in operation, or […]
FPGA modules incorporate write-protected configuration memory for enhanced security
Acromag’s new XMC-7AWP and XMC-7KWP modules, with a user-programmable Xilinx Artix-7 or Kintex-7 FPGA, feature write-protected flash memory to secure the configuration files. These modules are well-suited for a broad range of applications such as; hardware simulation, communications, signal intelligence, adaptive filtering, and image processing. High-speed interfaces are provided for PCIe, 10GbE, LVDS, serial, and other I/O signals. User-configurable […]
Voice-controlled AI enables low-power contactless image processing
Renesas Electronics Corporation announced the joint development of a voice-controlled multimodal AI solution that enables low-power contactless operation for image processing in vision AI-based IoT and edge systems, such as self-checkout machines, security cameras, and video conference systems, and smart appliances such as robotic cleaning devices. The new solution combines the Renesas RZ/V Series vision […]
MCU/neural net combo recognizes human faces
Maxim Integrated Products, Inc. and Xailient Inc. announced that Maxim Integrated’s MAX78000 ultra-low-power neural-network microcontroller detects and localizes faces in video and images using Xailient’s proprietary Detectum neural network. Xailient’s neural network draws 250x lower power (at just 280 microJoules) than conventional embedded solutions, and at 12 milliseconds (ms) per inference, the network performs in […]
New 112-layer SSDs hit 8 TB capacity for U.2, 4 TB for M.2 formats
Innodisk announces its industrial-grade 112-Layer 3D TLC SSDs along with the world’s highest capacity up to 8TB. The 112-layer SSDs introduce a complete product line including the SATA 3TG6-P and 3TE7 series, as well as the PCIe Gen3x4 and Gen4x4 series. The new TLC SSD Series marks Innodisk’s continued development with 3D NAND design, bringing […]