Softing adds to its Docker technology-based edgeConnector product family. The new edgeConnector Modbus is a flexible Docker container application for Modbus TCP controllers. After edgeConnector Siemens for connecting SIMATIC S7 controllers and edgeConnector 840D for accessing data from SINUMERIK 840D controllers, Softing introduces edgeConnector Modbus. This Docker Container is suitable for connecting Modbus TCP controllers […]
Tools
Updated reference model now includes RISC-V P extension and test suites
Imperas Software Ltd. announces the latest updates to riscvOVPsimPlus with support for the near ratified P extension and architectural validation test suites. The P (or Packed SIMD/DSP) extension is a significant addition to the flexibility of the modular RISC-V ISA (Instruction Set Architecture); it supports real-time data processing applications as part of the main processor pipeline […]
SSDs utilize advanced AI Engine, LDPC, Flash I/F to improve NAND endurance
PNY announced the launch of the LX2030 and LX3030 lines of ultra-high endurance SSDs to the company’s assortment of solid-state drives. The new LX families of SSDs offer ever-higher levels of endurance designed for “proof of space and time” applications like Chia (XCH) Plotting. The PNY LX2030 and LX3030 M.2 NVMe SSDs are the ideal […]
ARM-based DAQs target T&M, condition monitoring apps
ADLINK Technology Inc. added MCM-216 and MCM-218 models to the MCM-210 standalone Ethernet DAQ series. MCM-216/218 Ethernet DAQ, based on ARM Cortex-A9 processors with built-in 16 or 8 channel, 16-bit, provide voltage or current input and can function as a standalone edge device without a host PC. The standalone Ethernet DAQ supports edge computing and […]
Qi 1.3 wireless charging reference design speeds development efforts
The Wireless Power Consortium (WPC) has recently released the Qi 1.3 specification that requires authentication for improved safety when transmitting up to 15W of power between a transmitter and a receiver. To meet the requirements of the specification, Microchip Technology Inc. announced a new Qi 1.3 wireless charging reference design providing developers of wireless charging systems for automotive and […]
Enterprise starter kit covers LoRaWAN device-to-cloud development
Digi International unveiled a new enterprise starter kit providing a complete LoRaWAN device-to-cloud solution, marking the company’s expansion into the low power wide area (LPWA) market. The turnkey starter kit offers a scalable, device-to-cloud onboarding experience that saves time, capital, and resources. The Digi solution helps enterprises meet their digital transformation needs with faster time to […]
PIC MCU dev board features SiBRAIN sockets, Codegrip debugger/ programmer
MikroElektronika has launched FUSION for PIC v8, offering universal support for PIC, dsPIC, PIC24, PIC32 microcontrollers on one board. FUSION development boards are ideal for rapid prototyping and are equipped with everything that engineers require for their newest project development. Redesigned from the ground up, FUSION for PIC v8 includes SiBRAIN sockets. SiBRAIN is the new […]
Intel-based CoMs feature soldered RAM for high shock/vibration resistance
congatec introduces new 11th Gen Intel Core processor-based Computer-on-Modules with soldered RAM for the highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications. For more price-sensitive […]
Dual-output, automotive dead reckoning module qualified for operation up to 105 C
u-blox is introducing a series of automotive-grade positioning modules that are operational up to 105 °C. The NEO-M9L modules and the M9140-KA-DR chip are built on the robust u-blox M9 GNSS platform and use dead reckoning techniques to provide accurate position data when satellite signals are compromised or unavailable. The u-blox NEO-M9L-20A and NEO-M9L-01A modules, […]
MIPI A-PHY v1.0 spec is now part of IEEE standard
The MIPI Alliance announced the adoption of the MIPI A-PHY v1.0 specification as an IEEE standard. Published as IEEE 2977-2021, IEEE Standard for Adoption of MIPI Alliance Specification for A-PHY Interface (A-PHY) Version 1.0, A-PHY is the first asymmetric, industry-standard, long-reach, serializer-deserializer (SerDes) physical layer interface for automotive applications. The process was initiated in October 2020 […]