The STMicroelectronics STEVAL-IDB008V1M Bluetooth Low Energy 5.0 (BLE) evaluation platform accelerates application development with modules featuring BlueNRG-2, the Company’s second-generation BLE System-on-Chip (SoC). BlueNRG-2 supports the Bluetooth 5.0 certification, which allows enhanced security with LE Secure Connections, power-efficient privacy with Link Layer Privacy 1.2, and up to 2.6-times higher throughput with LE Data Length Extension. The SoC […]
Serial-attached SCSI 24G SSDs target servers, enterprise storage
KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) became the first company to bring 24G SAS to server and storage applications with the introduction of its 6th-generation enterprise SAS SSD family. First demonstrated at Flash Memory Summit 2019, KIOXIA’s new PM6 Series of enterprise SAS SSDs is built on 24G SAS technology. Designed for modern IT […]
Low-power pulse density modulation mic targets mobile, IoT and consumer devices
TDK Corporation introduces the InvenSense T3902, the world’s lowest power Pulse Density Modulation (PDM) microphone for mobile, IoT and other consumer devices. The T3902 is an ultra-low power, low noise, multi-mode bottom-port MEMS microphone, enhancing voice-based services which are now commonplace in many devices and homes. The microphone offers an exceptionally efficient 185 µA ultra-low […]
Development tools for FPGA/eFPGA technology go open source
QuickLogic Corporation announced its QORC (QuickLogic Open Reconfigurable Computing) initiative, making it the first programmable logic vendor to actively embrace a fully open source suite of development tools for its FPGA devices and eFPGA technology. This initiative engenders the emerging trend toward open source tooling, significantly broadens access to the company’s products, and enables both hardware […]
Vision kit carries three virtual machines/hypervisor for workload consolidation
congatec announces its new workload consolidation kit for vision-based situational awareness that is qualified by Intel as Intel IoT RFP (Ready For Production) Kit. Based on a COM Express Type 6 module equipped with Intel Xeon E2 processor, the RFP kit has three virtual machines (VMs) built on Real-Time Systems’ hypervisor technology for workload consolidation […]
RAID adapters designed for cost-sensitive end applications
To support cloud, enterprise, and workstation customers that require the robustness and performance of hardware RAID at an entry-level cost point, Microchip Technology Inc. announces the Adaptec SmartRAID 3100E RAID adapters which are designed to provide reliable hardware RAID protection for customer data in cost-sensitive end applications. The SmartRAID 3100E provides over 60 percent performance acceleration over […]
Static code analysis tool adds coverage for MISRA C:2012 Amendment 1
IAR Systems announces an update of its static code analysis tool C-STAT, an add-on product completely integrated in the complete C/C++ compiler and debugger toolchain IAR Embedded Workbench. The latest version of C-STAT adds coverage for MISRA C:2012 Amendment 1. C-STAT performs advanced code analysis to find potential issues. The analysis provides code alignment with […]
Wi-Fi + Bluetooth 5 combo modules target industrial IoT apps
Laird Connectivity has announced the upcoming Sterling-LWB5+ Wi-Fi 5 (802.11ac) and Bluetooth 5.1 module. Powered by CYW4373E silicon from Cypress, an Infineon Technologies company, the Sterling-LWB5+ is purpose-built for industrial Internet of Things (IoT) connectivity through a secure, reliable, and robust feature set. Laird Connectivity’s new Sterling-LWB5+ was intentionally designed for industrial IoT applications where performance, size, […]
Rubidium oscillator delivers ±0.03ppb frequency accuracy
Suntsu Electronics’ new RSO30S-10.000M rubidium oscillator delivers a frequency stability of 0.03ppb irrespective of temperature fluctuations over an operating temperature range of -40 to +60 degrees C. This latest model is designed with a standard connector interface that enables easy integration into time and frequency systems for industries such as telecommunications, defence and test & […]
On-chip thermal sensor takes up 7x less IC space
Moortec announced an addition to its deeply embedded monitoring portfolio, the Distributed Thermal Sensor (DTS) on TSMC N5 process technology. Moortec’s highly granular DTS offers a 7x area reduction in comparison to some standard in-chip thermal sensor solutions, and also supports high accuracy measurement across a wide temperature range at enhanced conversion speeds. With over […]
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