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Lee Teschler

ARM MCU-with-NFC combo targets smart actuator uses

July 22, 2022 By Lee Teschler

Open source TP

With integrated H-Bridge and energy harvesting modules, a smart actuator can be implemented in a single-chip solution with minimum components required. Infineon Technologies AG has developed a new programmable 32-bit ARM Cortex-M0 microcontroller (MCU) with embedded near-field communication (NFC) frontend to enable cost effective development of smart actuators, such as passive locks. Using the NFC […]

Filed Under: Applications, IoT Tagged With: infineontechnologies

Mission-critical LTE antenna operates between 698 – 960 MHz

July 19, 2022 By Lee Teschler

HUBER+SUHNER

The LTE700 antenna is the latest addition to the HUBER+SUHNER critical communications portfolio enabling reliable communication for private and mission critical networks. The LTE700 antenna operates between a range of 698 – 960 MHz and is able to empower private networks across a number of verticals, from private business operations such as water metering and […]

Filed Under: network hardware Tagged With: hubersuhner

Secure IP gives SoCs cryptographic capabilities

July 12, 2022 By Lee Teschler

kudelski

Secure IP hardware enclaves give semiconductor manufacturers robust cryptographic capabilities when integrated into their system on chip (SoC) products. Companies benefit from a rich array of security services, which are more powerful integrated in hardware than software, while also complying with most common industry security standards including NIST, FIPS, PSA and SESIP Level 3 or […]

Filed Under: Uncategorized

Production-grade connectivity framework optimized for software-defined vehicles

June 28, 2022 By Lee Teschler

rti

RTI Connext Drive 2.0 is a production-grade connectivity framework for software-defined vehicles. Connext Drive now accelerates direct integrations into AUTOSAR Classic and ROS 2, enabling developers to leverage data-centric connectivity with familiar ecosystem architectures. This allows a faster start to build on existing, familiar platforms and eliminates the need for custom programming. It also minimizes […]

Filed Under: Applications, Automotive Tagged With: realtimeinnovations

Wi-Fi 7 front-end modules target automotive, IoT apps

June 27, 2022 By Lee Teschler

qualcomm

New RFFE modules are designed for Bluetooth, Wi-Fi 6E, and the next-generation standard, Wi-Fi 7. The modules are designed for a wide array of device segments beyond smartphones – including automotive, XR, PCs, wearables, mobile broadband, IoT, and more. “With Qualcomm Technologies’ new products, we are extending our RFFE leadership into automotive and IoT, helping […]

Filed Under: Applications, IoT, Products, transceivers, Wireless Tagged With: qualcommtechnologiesinc

Voltage-level translator for SIM card interface circuits

June 24, 2022 By Lee Teschler

halo

The HL5301 is a subscriber identity module (SIM)/smart card level translator that provides the level shifting and IEC61000-4-2 electrostatic discharge (ESD) protection for SIM card ports. The HL5301 device integrates two unidirectional level shifters for the RST and CLK signals, and bi-directional level shifter for IO, and ±8kV ESD protection on all SIM card contacts. […]

Filed Under: Applications, Products Tagged With: halomicroelectronics

Real-time processor families target software-defined vehicle apps

June 21, 2022 By Lee Teschler

nxp

The S32Z and 532E processor families help enable the automotive industry to accelerate the integration of diverse real-time applications for domain and zonal control, safety processing and vehicle electrification that are critical to the next generation of safer and more efficient vehicles. The S32Z processors are ideal for safety processing and domain and zonal control, […]

Filed Under: Automotive, Embedded, Hardware, microcontroller Tagged With: nxpsemiconductor

First 1.5TB microSD card, ASIL-D-certified memory

June 21, 2022 By Lee Teschler

micronb

The world’s highest capacity microSD card carries 1.5 terabytes (TB) – designed with the world’s first 176-layer 3D NAND, is pioneered by Micron. The new i400 microSD is designed to deliver industrial-grade video security. Micron has received the first International Organization of Standardization (ISO) 26262 Automotive Safety Integrity Level (ASIL) D certification of memory for […]

Filed Under: Automotive, Memory, Products Tagged With: microntechnologyinc

Embedded 2.4-GHz wireless modules optimized for flexible mesh networks

June 20, 2022 By Lee Teschler

fujitsu

The FWM7BLZ22x series of Wirepas Mesh 2.4 GHz embedded wireless modules meet the increasing need for flexible mesh network designs. The series includes three models: FWM7BLZ22W (Sink): The Sink, which interfaces between the router nodes (Anchors) and gateway software, is controlled by a host CPU using Wirepas Dual-MCU API via USB or UART. FWM7BLZ22P (Anchor): […]

Filed Under: network hardware, radio modules, Wireless Tagged With: fujitsucomponentsamerica

NVIDIA-based board targets advanced AI computing

June 17, 2022 By Lee Teschler

elma

An embedded single-board computing (SBC) engine leverages the integrated deep learning capabilities and rich I/O of the NVIDIA Jetson AGX Xavier. The 3U CPCI Serial-based JetKit-3010 delivers artificial intelligence (AI)-enabled video inspection, analysis, object detection and recognition capabilities to system developers building advanced technologies to develop, test and manufacture smarter and more reliable systems in […]

Filed Under: Applications, Artificial intelligence Tagged With: elmaelectronicinc

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