STMicroelectronics has added new features to the TouchGFX software framework for STM32 microcontrollers (MCUs), streamlining creation of attention-grabbing user interfaces for domestic appliances, home automation, industrial controls, medical devices, and wearables. The latest version introduces TouchGFX Generator to make setting up a project and configuring related peripherals easier than ever. This plugin to the STM32CubeMX initialization tool generates a […]
Digital pressure/temperature sensor targets embedded apps
Miniaturization, performance, and precision are key for sensors embedded in consumer devices like swim watches and diving equipment, therefore creating a growing need for high-performing and exceptionally precise sensors. To address this growing demand, TE Connectivity (TE) has released the MS5839-02BA, an ultra-compact, chlorine resistant digital pressure, and temperature sensor. The MS5839 is a digital […]
Desktop Development Kit enables textures/haptic effects defined by software
Tanvas, Inc. announces the general availability of the TanvasTouch Desktop Development Kit. TanvasTouch surface haptics enable textures and haptic effects to be defined by software and felt with the swipe of a finger on touch-enabled surfaces. The TanvasTouch Desktop Development Kit includes everything you need to create software-defined textures and haptic effects that can be […]
i.MX 8M family of chipsets to host digital audio platform
Swedish sound pioneer Dirac and NXP Semiconductors today announced a collaboration to combine one of the world’s most powerful audio chipsets with a market-leading digital audio platform. By equipping the NXP i.MX 8M family of chipsets with Dirac’s digital audio platform, OEMs can enable their devices with maximized, immersive, and adaptive sound across their complete […]
3D image sensor uses Time of Flight, targets consumer electronics
Reliable face authentication, improved photo functions and authentic augmented reality experiences: 3D depth sensors assume a key role in smartphones and for applications that rely on accurate 3D image data. Infineon Technologies AG has collaborated with software and 3D Time of Flight system specialist pmdtechnologies ag to develop the world’s smallest and at the same […]
Software handles low-power motion-based gesture control/3D motion tracking/pointing for consumer handhelds
CEVA, Inc. introduced a new generation of its Hillcrest Labs sensor fusion product family, with the launch of the MotionEngine Air software. This production-ready solution delivers low power, motion-based gesture control, 3D motion tracking and pointing for consumer handheld devices in high volume markets, among which are smartphone and PC stylus pens, smart TV and […]
Security cryptocontroller targets contactless payment apps
Infineon Technologies AG new 40nm generation of security chip solutions – the SLC3x – is based on a design concept that provides performance and scalability for a vast array of smart card applications and beyond. Smart card manufacturers and payment solution providers will benefit from a family architecture based on the de-facto industry standard Arm. […]
First 3-W surface-mount, flip-chip, back-emitting VCSEL array needs no package submount/bond wires for mobile 3D sensing cameras
TriLumina announces the launch of the world’s first 3 W surface-mount, flip-chip, back-emitting VCSEL array without the need for a package submount or bond wires for mobile 3D sensing cameras. This new VCSEL-on-Board (VoB) technology enables higher performance, smaller size and lower costs, and simplifies time-of-flight (ToF) camera supply chains as compared to conventional VCSELs […]
Optical color sensor eliminates unwanted image artifacts in smartphone cameras
ams introduced the TCS3408 optical color sensor that enables smartphone world-facing cameras with rolling shutter image sensors to eliminate unwanted image artifacts – such as banding – that are caused by the flickering of artificial light sources. With the wide-spread usage of LED lighting, photography increasingly suffers from what is known as flicker from the […]
Bluetooth 5.0 audio SoC, modules shrink BOM costs via integrated features
To help Bluetooth speaker and headphone manufacturers maintain product differentiation in the competitive wireless audio market, Microchip Technology Inc. released the next generation of its Bluetooth 5.0-qualified dual-mode audio IC and fully certified module. Measuring just 5.5 x 5.5 mm, the low-power IS2083BM IC is ideal for small form factor designs and gives developers more space to […]
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