Efficient Computer has released the Electron E1 processor and made the effcc Compiler available for direct integration into developer toolchains. This is the first standalone hardware release from the company, enabling engineers to design and deploy intelligent applications where energy consumption and compute resources are tightly constrained. The Electron E1 processor is based on Efficient’s […]
Data centers
Four-channel radar sensors feature CAN XL and Ethernet connectivity interfaces
Bosch introduced two system-on-chips for automotive radar sensors supporting SAE level 2+ driver assistance functions. The SX600 and SX601 enable automatic emergency braking, adaptive cruise control, blind spot detection, and lane change assistance. The SoCs feature a digital phase-locked loop that adjusts output signal frequency and phase to match input signals. This digital PLL design […]
SLC NAND technology enables AI edge computing in orbital environments
Micron Technology, Inc. announced that it is launching the industry’s highest-density, radiation-tolerant single-level cell (SLC) NAND product. With a die capacity of 256 gigabits (Gb), this product is the first in a portfolio that will include space-qualified NAND, NOR, and DRAM solutions. The product is available now and represents the first in its class to […]
RAID storage system supports PCIe Gen 5 and Gen 4 connectivity
HighPoint Technologies introduces its next-generation NVMe RAID storage solutions, engineered to meet the demanding data ingestion and processing requirements of AI, autonomous systems, and professional media applications. Combining industry-leading PCIe switching architecture with advanced RAID technologies, these solutions deliver unparalleled speed, reliability, and scalability for high-volume data capture, real-time analytics, and long-term storage. HighPoint’s proprietary […]
SRAM recovers 15% silicon area on 2 nm process with 6 gigabit memory capacity
Marvell Technology, Inc. expanded its custom technology platform with the launch of the industry’s first 2nm custom Static Random Access Memory (SRAM), designed to boost the performance of custom XPUs and devices powering cloud data centers and AI clusters. Combining advanced custom circuitry and software from Marvell with core SRAM and cutting-edge 2nm process technology, Marvell […]
PCI SIG release PCIe 7.0 specification
PCI-SIG announced the official release of the PCI Express (PCIe) 7.0 specification, reaching 128.0 GT/s, to members. PCIe 7.0 specification targets data-driven applications like AI/ML, 800G Ethernet, cloud, and Quantum computing. Pathfinding for the PCIe 8.0 specification is already in progress to continue supporting the industry’s investments and product roadmaps in the PCIe technology ecosystem. […]
Linear redrivers support PCIe 6 with PAM4 modulation
Diodes Incorporated introduces the industry’s first ReDriver to reach PCI Express (PCIe) 6.0 protocol speeds (up to 64 GT/s) while being backward-compatible with PCIe 5.0/4.0/3.0 protocols. The PI3EQX64904 is a low-power, high-performance, 64GT/s, four-differential-channel, PAM4, linear ReDriver. Target applications include AI data centers (storage and servers), workstations, 5G networking, CPU-to-network (PCIe NIC card) and CPU-to-storage (NVME) […]
Integrated USB-C, CAN, I3C and LP UART interfaces reduce external component requirements
Renesas Electronics Corporation introduced the RA2L2 microcontroller (MCU) group with ultra-low power consumption and the industry’s first support for the new UCB-C Revision 2.4 standard. Based on a 48-MHz Arm Cortex M23 processor, the new MCUs offer a rich feature set that makes them ideal for portable devices and PC peripherals such as gaming mice and […]
Multi-gigahertz clocks boast LVDS, CML, LVPECL output options
Mixed Signal Devices has announced its MS11X0 oscillator and MS15X0 jitter attenuator families for computing and communications systems. The timing devices are built on 28 nm CMOS technology and incorporate the company’s Virtual Crystal architecture to address requirements in AI data centers, 5G base stations, and radar applications. The MS1130 and MS1150 oscillators operate at […]
Active cooling platform targets enterprise E3.S and consumer M.2 SSDs
xMEMS Labs, Inc. announced the expansion of its µCooling fan-on-a-chip platform to solid-state drives (SSDs). The technology enables in-drive active cooling for enterprise E3.S form factor SSDs used in AI data centers and NVMe M.2 SSDs used in laptop PCs. SSD thermal management has traditionally relied on passive heat spreaders and ambient airflow from system […]
