Kioxia Corporation announced the launch of the second generation of XL-FLASH, a Storage Class Memory (SCM) solution based on its BiCS FLASH 3D flash memory technology, which significantly reduces bit cost while providing high performance and low latency. Product sample shipments are scheduled to start in November this year, with volume production expected to begin […]
Data centers
Verification IP (VIP) handles virtual network co-simulation for 800Gbps Ethernet 2-7 network stack
Avery Design Systems announced that its fully-tested Verification IP (VIP) for 800Gbps Ethernet can now be used to perform virtual network co-simulation for the full layer Ethernet 2-7 network stack. The combination of the VIP and a virtual co-simulation/co-emulation system enables the running of full hardware/software system verification on pre-silicon SoC RTL and software integrations. […]
SSDs feature low latency, high DWPD, large capacities
Innodisk is pushing the development of edge AI technology. In doing so has officially launched a new edge computing solid-state drive (SSD) product line, consisting of the 2.5” SATA 3TS6-P, 3TS9-P, and M.2 (P80) 4TS2-P drives. Innodisk’s new edge AI SSDs feature low latency, high DWPD (drive writes per day), and large capacities. In addition, the included iCell and AES technologies protect […]
PCIe Gen5 SSD optimized for QoS
Silicon Motion Technology Corporation announces MonTitan, a PCIe Gen5 SSD solution platform perfectly suited for the most challenging Datacenter and Enterprise applications. Silicon Motion’s new MonTitan platform features an entirely new, purpose-built ASIC and FW architecture, optimized for performance and QoS. Its unique Layered FW stack enables the development of customer differentiated solutions with a […]
PCIe 3.0 packet switch addresses fan-out, multi-host connectivity
Diodes Incorporated announced the introduction of a PCIe 3.0 packet switch IC. DIODES PI7C9X3G1632GP provides flexible multi-port and lane width configuration, resulting in elevated levels of performance and availability. This will prove beneficial in systems dealing with AI/deep learning workloads, data storage equipment, the servers in data centers, wireless/wireline telecommunications infrastructure, and various forms of modern […]
RISC-V multiprocessor IP cores boast high scalability
MIPS announces its entrance to the RISC-V market, previewing the first products in its eVocore product lineup. The new eVocore P8700 and I8500 multiprocessor IP cores are the first MIPS products based on the RISC-V open instruction set architecture (ISA) standard. The new eVocore multiprocessor IP cores are the first MIPS products based on the […]
Industrial-grade DDR5 R-DIMM modules feature data transfer rates to 4,800 MT/sec
ADATA Technology launched new industrial-grade Registered DIMM (R-DIMM) DDR5 memory modules. This completes a full suite of industrial-grade DDR5 including U-DIMM, SO-DIMM, and now R-DIMM modules designed for the latest Intel 12th Generation processors, and future DDR5 platforms. ADATA industrial-grade R-DIMM DDR5 memory modules are suitable for a wide range of applications, including 5G backhaul equipment, AIoT, […]
NVDIA platform targets AI medical platforms
NVIDIA introduced Clara Holoscan MGX, a platform for the medical device industry to develop and deploy real-time AI applications at the edge, specifically designed to meet required regulatory standards. Clara Holoscan MGX expands the Clara Holoscan platform to provide an all-in-one, medical-grade reference architecture, as well as long-term software support, to accelerate innovation in the medical device […]
Data center SSD includes 176-layer NAND
Micron Technology, Inc. announced it is sampling the world’s first vertically-integrated 176-layer NAND solid-state drive (SSD) for the data center. The Micron 7450 SSD with NVMe delivers quality-of-service (QoS) latency at or below 2 milliseconds (ms),1 a wide capacity range, and the broadest set of form factors available to meet the needs of the most […]
Low-cost, low-power, IoT-optimized ICs support VoLTE, throughput exceeding LTE-M
Sequans Communications S.A. announced the availability of a new series of Cat 1 IoT modules based on its second generation, LTE Cat 1bis chip, Calliope 2. The new Calliope 2 GC02S1 modules are low-cost, low-power, IoT-optimized solutions that support VoLTE and throughput higher than LTE-M for applications including wearables and hearables with music streaming; smart […]
