Orbel is announcd the latest development in shielding technology, the Groove-LocTM EMI Shield The Groove-Loc is a revolutionary way to prototype shielding for a printed circuit board. This two-part system consists of a bendable, formable fence strip and a locking cover. The fence can be shaped and trimmed to match most any rectangular footprint, and […]
Applications
Shot camera, sensor development kits get middleware support for global public clouds
ON Semiconductor has announced that the RSL10 Smart Shot Camera and the RSL10 Sensor Development Kit have been pre-integrated within the Bosch IoT Suite, the Bosch Group’s core software platform and core software ecosystem for the Internet of Things (IoT). The RSL10 Smart Shot Camera and the RSL10 Sensor Development Kit are complete node-to-cloud solutions […]
Micro-rotary DIP Switches target space-constrained designs
CUI Devices’ Switches Group announced the addition of micro rotary actuator types to its DIP switches product line. Housed in compact 7.2 x 7.2 x 2.9 mm packages, the RDS-7229 series features 4, 10, or 16 positions, a 5.08 mm pitch, and surface mount or through-hole mounting styles. Thanks to their compact footprints and IP67 […]
Development system includes debug-through-sleep, breakpoint in flash capabilities
Green Hills Software announced new capabilities that increase the productivity of software developers creating safety-sensitive automotive software when they use the MULTI integrated development environment (IDE) and Green Hills Probe for the Infineon TRAVEO II processor. These new features enable software teams at automotive manufacturers and their global Tier 1 suppliers to reduce the time-to-production while increasing […]
MIPI C-PHY / D-PHY combo IP supports 2.5 Gbps SoC designs
Arasan Chip Systems announced the immediate availability of its MIPI C-PHY / D-PHY Combo IP supporting speeds of up to 2.5 Gbps for SoC designs on the TSMC 22nm process. The MIPI C-PHY / D-PHY Combo IP is seamlessly integrated with Arasan’s own CSI Tx, CSI Rx, DSI Tx, and DSI Rx as part of […]
Tools help developers implement security standards for embedded designs
Secure Thingz announced Compliance Suite, a set of tools and training specifically targeted to provide embedded developers with a simplified path to building applications that are compliant with the European EN 303645, UK & Australian 13 Best Practices, and the evolving US Cybersecurity Improvement Act (NISTIR 8259). Compliance is a challenge for every organization working […]
Optical clock and data recovery IC aimed at 5G, front-haul applications
Semtech Corporation announced sampling of a new solution (GN2255), Semtech’s Tri-Edge CDR to enable emerging 50Gbps PAM4 5G front haul deployments. Based on the proven Tri-Edge CDR platform qualified in data center applications, the new solution delivers the cost-effectiveness, small footprint, low power, ultra-low latency, and performance demanded by 5G front haul applications. The […]
SBCs carry i.MX RT1176 MCUs, target secure mission-critical apps
Avnet is enhancing the launch of NXP Semiconductor’s i.MX RT1170 crossover MCU family with the MaaXBoard RT, a low-cost single-board computer that can be used as a development board or as a versatile building block for integration into original equipment manufacturer (OEM) custom systems. Advanced security features of the NXP i.MX RT1176 MCU, plus additional […]
Super-low-power arm cortex-M33 core MCUs feature advanced cybersecurity, graphics, peripherals
STMicroelectronics has announced a new generation of extreme power-saving microcontrollers (MCUs), the STM32U5* series, to meet the most demanding power/performance requirements for smart applications including wearables, personal medical devices, home automation, and industrial sensors. The industry-leading STM32 MCUs, built upon the highly energy-efficient Arm Cortex-M processors, are already in billions of domestic appliances, industrial controls, […]
Field area network module connects up to 1,000 mesh nodes
ROHM Semiconductor announced its new BP35C5 Wi-SUN FAN (Field Area Network) compatible module solution capable of connecting with up to 1000 nodes in mesh networks for infrastructure applications. Wi-SUN FAN, the latest Wi-SUN international wireless communication standard, eliminates the communication costs associated with conventional LPWA. At the same time, Wi-SUN ensures superior reliability through multi-hop networks […]
