Congatec presents a brand new COM-HPC starter set at embedded world 2021 DIGITAL. Ideal for modular system designs utilizing the latest high-speed interface technologies such as PCIe Gen4, USB 4.0, and up to ultra-fast 2×25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel […]
Applications
Oscillators for LVPECL, LVDS feature low current consumption
Battery-powered, wireless communication products require not only a high data rate but low current consumption to reduce power loss. Suntsu is introducing a new set of oscillators, the SLO series, to meet these market demands and with the lowest current consumption and unmatchable phase noise performance. The SLO Series oscillator is designed with fundamental and third […]
Five, six-junction vertical-cavity surface-emitting laser arrays target consumer, automotive LiDAR, 3D sensing apps
Lumentum Holdings Inc. announced new high-power and high-efficiency five and six junctions vertical-cavity surface-emitting laser (VCSEL) arrays for advanced consumer, automotive LiDAR, and other 3D sensing applications. The use of LiDAR and 3D sensing is expanding into new applications in the consumer electronics, automotive, and industrial markets. New applications and new functionality are driving the need for higher […]
Industrial-rated carrier provides extensive connectivity for Type 10 mini-module designs
WINSYSTEMS today introduced its first Mini-ITX form factor carrier board to complement and support its COMeT10-3900 COM Express Type 10 mini modules. The ITX-M-CC452-T10 carrier platform is designed with industrial components for testing products in development and to deliver highly reliable performance in operating environments with temperatures of -40°C to +85C°. WINSYSTEMS’s newest COM Express market entry offers the assurance […]
Applications processor enables ultra-low power processing and trusted cloud-to-edge security
NXP Semiconductors N.V. today announces the expansion of its EdgeVerse portfolio with its crossover applications processors, including i.MX 8ULP and i.MX 8ULP-CS (cloud secured) Microsoft Azure Sphere-certified families, as well as next-generation i.MX 9 series of high performance intelligent applications processors. The expansion includes new innovations with EdgeLock secure enclave to enhance edge security and […]
Silicon photomultiplier array targets automotive LiDAR apps
ON Semiconductor announced the new RDM-Series silicon photomultiplier (SiPM) array that extends the LiDAR sensor capabilities to its broad portfolio of intelligent sensing solutions. The ArrayRDM-0112A20-QFN is the first automotive qualified SiPM product in the market, ready for the growing demands in LiDAR applications for the automotive industry and beyond. The ArrayRDM-0112A20-QFN is a monolithic […]
Optimized 32-bit MCU targets IoT edge applications
Silicon Labs announced the launch of the EFM32PG22 (PG22) 32-bit microcontroller unit (MCU), a low-cost, high-performance solution with an industry-leading combination of energy efficiency, performance, and security. With easy-to-use, cost-efficient analog capabilities, the PG22 MCU is ideally suited for the rapid development of consumer and industrial applications with demanding size constraints and low-power operation requirements. […]
Automotive Wi-Fi 6E modules connect in-vehicle infotainment systems
LG Innotek announced on March 2nd that it has developed the world’s first automotive Wi-Fi 6E module with next-generation Wi-Fi technology. Automotive Wi-Fi 6E modules are near-field wireless communication components connecting in-vehicle infotainment (IVI) systems, which control driving information and multimedia content, to internal smart devices and external routers. With the next-generation Wi-Fi 6E (6th […]
WiFi 6/6E and Bluetooth 5.2 SoCs available as 1×1 and 2×2 devices
Infineon Technologies AG is expanding its wireless portfolio of high-performance, reliable and secure offerings. The newly developed AIROC brand now includes the industry’s first 1×1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for the IoT, enterprise, and industrial applications, and its first 2×2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer, and automotive […]
Development platform delivers smartphone-like UX on low-power hardware
Crank Software continues to innovate with the launch of Storyboard 7.0, a development platform built to deliver smartphone-like user experiences (UX) on low-power, tightly-resourced hardware. With increasing consumer expectations and the number of IoT-connected devices projected to increase to 43 billion worldwide by 2023, Storyboard’s new Rapid Design Import and Iteration Technology meet the needs […]
