Numem will be at the upcoming Chiplet Summit to showcase its high-performance solutions. By accelerating the delivery of data via new memory subsystem designs, Numem solutions are re-architecting the hierarchy of AI memory tiers to eliminate the bottlenecks that negatively impact power and performance. The rapid growth of AI workloads and AI Processor/GPUs are exacerbating the memory bottleneck […]
Storage
Chip design framework shows 2-3x efficiency for AI processing
Arm has released the first public specification of its Chiplet System Architecture (CSA), a framework for standardizing chipset connectivity and system partitioning. The specification is now supported by more than 60 technology companies, including ADTechnology, Alphawave Semi, AMI, Cadence, Jaguar Micro, Kalray, Rebellions, Siemens, and Synopsys. The CSA framework enables designers to create reusable chipsets […]
Embedded computing series integrates four 2.5 GbE network ports
Advantech has introduced two AI-integrated desktop platforms: the Mini-ITX AIMB-2710 and Micro-ATX AIMB-589. These platforms use Intel® Core™ Ultra Processors (Series 2) S-Series, integrating an NPU capable of 36 TOPS for AI acceleration. The platforms include PCIe Gen5 support for GPU cards and come equipped with 6400MHz DDR5 memory, USB4 Type-C, multiple USB 3.2 Gen2, […]
133 MHz QSPI NOR Flash memory designed for extreme environments
Infineon Technologies AG has introduced a radiation-hardened-by-design 512 Mbit QSPI NOR Flash memory for space and extreme environment applications. The device features a quad serial peripheral interface operating at 133 MHz and is QML-qualified for use with space-grade FPGAs and microprocessors. Developed in collaboration with the U.S. Air Force Research Laboratory, Space Vehicles Directorate (AFRL), […]
SSD controller offers full power-loss protection for boot drives
In the past 13 years, global data production has increased an estimated 74 times. To address this demand, ScaleFlux, a company in data storage and memory technology, is expanding its product portfolio. The company is introducing new controllers for NVMe SSDs and Compute Express Link (CXL) modules, adding to its technology for the data pipeline. […]
EEPROM targets IoT and wearable device storage needs
STMicroelectronics’ Page EEPROM combines the power efficiency and durability of an EEPROM with the capacity and speed of a Flash memory, creating a hybrid memory for applications that face extreme size and power constraints. The new memories address growing demand for storage in embedded applications, needed to support increasingly sophisticated features and run data-hungry edge-AI […]
SSD controller targets power efficiency in data centers
Microchip Technology has introduced the Flashtec NVMe 5016 Solid State Drive (SSD) controller to address the increasing demand for powerful, efficient, and reliable data centers driven by the growth of Artificial Intelligence (AI) and cloud-based services. The 16-channel, PCIe Gen 5 NVM Express (NVMe) controller is designed to provide enhanced bandwidth, security, and flexibility. The […]
Compact SSDs support PCIe Gen 4×4 with enhanced data integrality and i-temp compatibility
Silicon Motion Technology Corporation introduced the new generation FerriSSD NVMe PCIe Gen 4 x4 BGA SSD. This latest solution features support for i-temp and integrates advanced IntelligentSeries technology, delivering robust data integrity in extreme temperature environments that meet the rigorous demands of industrial embedded systems and automotive applications. The latest FerriSSD BGA SSD supports PCIe […]
Flash memory stores automotive data
KIOXIA America, Inc. announced sampling1 of the industry’s first2 Universal Flash Storage3 (UFS) Ver. 4.0 embedded flash memory devices3 designed for automotive applications. These new, higher performing devices deliver fast embedded storage transfer speeds in a small package size and are targeted to a variety of next-generation automotive applications, including telematics, infotainment systems and ADAS4. The improved performance5 of UFS products […]
Why 3D packaging could be the next breakthrough for processing
By Brian Hendren, Tektronix As semiconductor manufacturers start to reach the potential physical limits of shrinking process nodes, chip packaging is emerging to improve performance. Flip chip assembly remains the most popular method for interconnecting dies, but new advancements in silicon interposers are enabling 2.5D packaging architectures and, in turn, making 3D packaging possible. To […]
