Silicon Motion Technology Corporation announces MonTitan, a PCIe Gen5 SSD solution platform perfectly suited for the most challenging Datacenter and Enterprise applications. Silicon Motion’s new MonTitan platform features an entirely new, purpose-built ASIC and FW architecture, optimized for performance and QoS. Its unique Layered FW stack enables the development of customer differentiated solutions with a […]
Storage
Intelligent Edge Systems feature Intel Xeon D Processors
Super Micro Computer, Inc., a provider of enterprise computing, storage, networking, and green computing technology, announced the global availability of a range of systems for edge computing. This includes the recently announced SuperEdge and a range of Intel Xeon D processor-based systems with up to 20 cores, 25 GbE networking built-in, and a temperature operating […]
JEDEC XFM removable storage device complies with Ver.1.0 PCIe/NVMe Spec
KIOXIA America, Inc. announced sampling of the industry’s first XFM DEVICE Ver.1.0-compliant removable PCIe standard attached, NVMe storage device: the XFMEXPRESS XT2. With a new form factor and connector, the XFM DEVICE Ver.1.0 standard delivers a combination of features designed to advance ultra-mobile PCs, IoT devices, and a variety of embedded applications. First introduced in […]
What are basic logic gates?
Logic gates are the building blocks of digital circuits. The basic logic gates include AND, OR, NOT, NAND, NOR, XOR, and XNOR. They can be implemented in digital hardware using transistors and/or diodes. In a few applications, they are implemented using electromechanical relays, fluidics, pneumatics, or optical elements. A series of logic gates can be […]
SD and microSD cards from 16 to 512 GB support an extended temperature range
Swissbit is expanding its range of industrial-grade SD and microSD memory cards. With “high reliability” at their core, the new S-55 and S-58 series integrate state-of-the-art technologies, making them the first choice for demanding applications. Swissbit accomplishes this by combining leading-edge industrial-grade 3D TLC NAND technology with a powerful controller and firmware optimized for maximum […]
Automotive flash memory devices available in capacities to 512 GB
KIOXIA America, Inc. announced that it has started sampling new Automotive Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices. The new lineup utilizes KIOXIA cutting-edge BiCS FLASH 3D flash memory and is available in capacities from 64 gigabytes (GB) to 512GB to support the various requirements of evolving automotive applications that elevate driver experiences. […]
Non-volatile ReRAM provides 12 Mbit density
Fujitsu Semiconductor Memory Solution Limited announced on March 15 the launch of a 12Mbit ReRAM (Resistive Random Access Memory), MB85AS12MT. Evaluation samples are currently available. This new product is a non-volatile memory having a large memory density of 12Mbit in a very small package size of approximately 2mm x 3mm. It has an outstandingly low […]
Data center SSD includes 176-layer NAND
Micron Technology, Inc. announced it is sampling the world’s first vertically-integrated 176-layer NAND solid-state drive (SSD) for the data center. The Micron 7450 SSD with NVMe delivers quality-of-service (QoS) latency at or below 2 milliseconds (ms),1 a wide capacity range, and the broadest set of form factors available to meet the needs of the most […]
Rad-tolerant 2.5-in SSD holds up to 1 Tbytes
Aitech Systems has released the most compact network-attached storage (NAS) device available for use in near-earth orbit (NEO) and low earth orbit (LEO) space applications. The new S999 Aitech solid-state drive (ASSD) is a 2.5-inch solid-state drive (SSD) for high-performance spacecraft data processing or distributed computing systems in satellites and human-rated platforms. With a raw […]
UFS Ver. 3.3 embedded flash memory devices incorporate QLC technology for high density applications
KIOXIA America, Inc. announced the launch of its Universal Flash Storage (UFS)* Ver. 3.1 embedded flash memory devices with 4-bit-per-cell, quadruple-level cell (QLC) technology. For applications needing high density, such as cutting-edge smartphones, KIOXIA QLC technology enables the capability to achieve the highest densities available in a single package. The new 512 Gigabyte** QLC UFS PoC […]
