The industry’s first 512-gigabyte (GB) Automotive Universal Flash Storage (UFS) JEDEC Version 2.1 embedded memory solution supports a wide temperature range (-40 to +105°C), meets AEC-Q100 Grade24 requirements, and offers the extended reliability required by various automotive applications. The 512GB device joins the KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) lineup of Automotive UFS, […]
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Removable NVMe memory sits in 252-mm-sq footprint
Toshiba Memory today announced XFMEXPRESS, a new technology for removable PCIe attached, NVMe memory devices. With a new form factor and an innovative connector, XFMEXPRESS technology delivers an unparalleled combination of features designed to revolutionize ultra-mobile PCs, IoT devices and various embedded applications. Recognizing the need for a new class of removable storage, Toshiba Memory […]
Persistent memory FLASH chips feature low latency and speed
New Storage Class Memory (SCM) XL-FLASH chips are based on Toshiba’s BiCS FLASH 3D flash memory technology with 1-bit-per-cell SLC. XL-FLASH brings low latency and high performance to data center and enterprise storage. Sample shipments will start in September, with mass production expected to begin in 2020. Classified as SCM (or persistent memory), with the […]
SSDs play in high-end workstation PCs and gaming systems apps
Toshiba Memory America, Inc. announced the XG6-P solid state drive (SSD) series, a derivative of its NVMe M.2-based XG6 Series featuring class-leading write performance. Offering up to 2,048 gigabytes (GB) of capacity, XG6-P SSDs are ideal for high-end workstation PCs and gaming systems, as well as cost-optimized data center and composable infrastructures. With over 30 […]
Universal flash storage devices sport automotive qualification specs
Toshiba Memory America, Inc. today announced that it has begun sampling new Automotive UFS JEDEC Version 2.1 embedded memory solutions. The company’s Automotive UFS supports a wide temperature range (-40°C to +105°C), meets AEC-Q100 Grade2 requirements and offers the enhanced reliability required by various automotive applications. The lineup consists of four capacities: 32 gigabytes, 64GB, […]
Low-profile SSDs target cloud data center uses
Toshiba Memory America, Inc. the U.S.-based subsidiary of Toshiba Memory Corporation, announced the availability of its XD5 Series NVMe SSD platform in a 2.5-inch1, 7mm low-profile form factor that is optimized for low-latency and performance consistency in read-intensive workloads. Developed for both data center and cloud environments, the new 2.5-inch form factor XD5 Series is […]
1 TB single-package PCIe Gen3 x4L SSDs sport 96-layer 3D Flash memory
Toshiba Memory America, Inc. will introduce the fourth generation of its single package ball grid array (BGA) solid state drive (SSD) product line: the BG4 series. Toshiba Memory’s new lineup of ultra-compact NVMe SSDs places both the flash and an all-new controller into one package, bringing design flexibility to ultra-thin PC notebooks, embedded systems and server […]
New flash memory chip holds 1.33 terabits with four bits/cell
Toshiba Memory America, Inc. (TMA) announced the development of a prototype sample of 96-layer BiCS FLASH, its proprietary three-dimensional (3D) flash memory, with 4-bit-per-cell (quad level cell, QLC) technology. With this milestone achievement, Toshiba demonstrates its technology leadership in the storage market by delivering technology that boosts single-chip memory capacity to the highest level yet achieved1. […]
CMOS image sensors for smartphones and tablets
SAN JOSE, Calif., Aug. 19, 2015 /PRNewswire/ — Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced its full lineup of backside-illuminated (BSI) CMOS image sensors equipped with phase detection auto-focus (PDAF) technology. In addition to the recently announced 16-megapixel (MP) T4KC3-121, the family […]
