Renesas Electronics Corporation announced the expansion of its RZ/V Series of microprocessors (MPUs) with the new RZ/V2L MPUs designed for entry-level AI-enabled applications. As part of the RZ/V Series, the new MPUs incorporates Renesas’ exclusive AI accelerator – the DRP-AI (Dynamically Reconfigurable Processor) – to make embedded AI easier and more power-efficient. The new RZ/V2L […]
Consumer Electronics
Haptics interface brings touch control to smartphone sides
The new NexusTouch sensing and localized haptic platform from Boréas Technologies allow designers to expand touch-based user interfaces on the sides of smartphones and gaming phones. The platform enables seamless context-sensitive swipes, taps, and clicks—all while delivering rich haptic feedback. Blending advanced gesture sensing with localized haptics, NexusTouch supports a range of new use cases, from finger-clicks that […]
Haptic platform allows context-sensitive swipes, taps, and clicks on smartphones, gaming phones
The new NexusTouch sensing and localized haptic platform from Boréas Technologies allows designers to expand touch-based user interfaces on the sides of smartphones and gaming phones. The platform enables seamless context-sensitive swipes, taps and clicks—all while delivering rich haptic feedback. Blending advanced gesture sensing with localized haptics, NexusTouch supports a range of new use cases, […]
Mobile PCI Express Modules target resource-constrained edge computing/embedded AI apps
ADLINK Technology Inc., today introduced the industry’s first embedded MXM-based graphics modules based on NVIDIA’s Turing architecture, to accelerate edge AI inference in SWaP-constrained applications. GPUs are increasingly used to provide AI inferencing at the edge, where size, weight and power (SWaP) are key considerations. The embedded MXM graphics modules offer high-compute power required to […]
Open-source initiative boosts TinyML apps
SensiML Corporation announced that it has launched an Open Source Initiative to accelerate the adoption of TinyML smart sensing IoT applications. The initiative builds upon SensiML’s existing efforts to design flexibility, transparency, and efficiency into its product suite by giving developers control and insight over vital aspects of their ML workflow, tools, data, and resulting […]
Teardown: Inside a video greeting card
For around $60, you can send a greeting card that incorporates a video. When the recipient opens the card, it can automatically play a video loop that you can upload. The card charges via a USB connection which also allows you to upload the video. Specs for cards we’ve seen typically mention a 2G memory, […]
ePaper displays sized to 42 in, come in varioius colors
DATA MODUL announces its cooperation with E Ink, the world’s largest manufacturer of ePaper products and technologies. DATA MODUL is thus expanding its own display portfolio with the tried-and-tested E Ink products and is adding both segment and active-matrix displays to its range for individual customer solutions. Available in sizes from 1.10” to 42.0”, the […]
Development chassis for 6U OpenVPX boards features VITA 67 RF, SOSA Interfaces
Pixus Technologies has announced a new 3-slot 6U OpenVPX development backplane and chassis platform. The open frame development chassis features the 6U OpenVPX power and ground-only backplane with 1 VPX slot and dual VITA 67.3c slots with cutouts in the P3 and P6 sections of the board. The versatile design allows both VITA 65 and […]
Waterproof MEMS barometric pressure sensors target smartwatch apps
TDK Corporation announces worldwide availability of the InvenSense ICP-10125, part of the SmartPressureTM family of the MEMS barometric pressure sensor platform. The ICP-10125 achieves the industry’s lowest pressure noise of 0.4 Pa RMS, attains the industry’s lowest power consumption of 1.3 µA, and ensures excellent temperature stability with a temperature coefficient of ±0.5 Pa/°C. The […]
Low-power cellular module combines MCU and modem
In conjunction with Sony Semiconductor Israel (Sony, formerly Altair Semiconductor), STMicroelectronics, and Truphone, Murata introduced the availability of the Type 1SE module, a highly integrated, miniaturized, low power cellular IoT solution featuring a low power STM32L4 MCU and an ALT1250 M1/NB modem. Measuring just 15.4 x 18.0 x 2.5 mm, it combines the key components […]