Pervasive Displays has added further value to its product offering through the inclusion of new capabilities. The company has now integrated a next-generation partial update feature into its EPDs so that a broader range of customer application demands can be addressed. The driving waveforms used for these partial updates have been optimized to deliver superior […]
Applications
Compiler supports multi-threading acceleration for CPUs with multiple physical cores
CacheQ Systems, Inc. announced support for multi-threading acceleration for CPUs with multiple physical cores through its new compiler, offering software developers the ability to “write once, accelerate anywhere.” A feature of the CacheQ Compiler Collection, the compiler eliminates manual code rewriting and the use of threading libraries or complex parallel execution APIs such as OpenMP […]
Cellular IoT module supports LTE Cat-M1 spec
Renesas Electronics Corporation introduced the RYZ014A, Renesas’ first cellular IoT module supporting the LTE Cat-M1 specification. This technology allows devices to directly connect to the internet without the need for a gateway by relying on the existing communication infrastructure owned by mobile network operators. This makes it economical to connect each device, which is especially […]
Open-source IMU providies 3D acceleration/rate/magnetic field sensing
ACEINNA Inc. announced the general availability of the OpenIMU335RI, a rugged inertial measurement unit (IMU) with CAN and RS232 interfaces. The OpenIMU335RI is the third product in ACEINNA’s Gen 3 architecture and adds a rugged sealed standalone product to the earlier introduced IMU383ZA and OpenIMU330BI. It delivers increased performance in key acceleration and gyro specifications. […]
Software stack speeds application development on low-power FPGAs
Lattice Semiconductor Corporation announced enhancements to its award-winning Lattice sensAI solution stack for accelerating AI/ML application development on low-power Lattice FPGAs. Enhancements include support for the Lattice Propel design environment for embedded processor-based development and the TensorFlow Lite deep-learning framework for on-device inferencing. The new version includes the Lattice sensAI Studio design environment for end-to-end ML model training, […]
Reference design handles AI processing-based 3D sensing for next-gen AI of things devices
Ambarella, Inc. announced two new joint reference designs that accelerate AIoT device deployment across verticals, building on the companies’ previous joint solution for contactless access systems. By combining the data from Lumentum’s high-performance VCSEL array illuminators and an ON Semiconductor image sensor using Ambarella’s AI SoC, higher levels of accuracy and more intelligent decision-making can be achieved […]
UVC camera reference design kit helps develop embedded apps
THine Solutions, Inc. introduced their new THEIA-CAM family of camera Reference Design Kits. The first Kit in the family is the THSCU101, a 13-megapixel Phase-Detection Auto-Focus (PDAF) USB Video Class (UVC) camera Reference Design Kit. The THSCU101 Kit is based on THine’s THP7312 image signal processor (ISP), Sony’s IMX258 13MP CMOS PDAF image sensor, and […]
PCIe 6.0 verification IP enables advanced debug and compliance checking
Avery Design Systems Inc. announced the availability of major updates to the company’s flagship PCI Express (PCIe) 6.0 and PIPE 6.0 VIP solution. Avery unveiled the solution at the PCI-Sig DevCon event this week. The solution supports the latest features and capabilities in the high-speed interconnect protocol, including a doubling of data rates compared to PCIe […]
PC/104 module sports quadro P1000 GPU
ADLINK Technology Inc. launched an industry-first solution, the CM5-P1000 module, expanding the company’s advanced solutions for artificial intelligence-enabled mission-critical applications. Supplied in a PCIe/104 Type 1 format (measuring 116mm x 96mm), this module addresses the size, weight, and power (SWaP) restrictions that aerospace and defense applications must adhere to. As an NVIDIA Elite Partner, ADLINK […]
SoC/RAM combo targets IoT hi-rez display apps
Winbond Electronics Corporation announced a collaboration to combine HyperRAM and Apollo4 to deliver ultra-low-power system solutions for IoT endpoints and wearables. Several customers are in design with Ambiq’s Apollo4 SoC and Winbond 256Mbx8 HyperRAM Hybrid Sleep Mode (HSM), with volume production expected in 2022. HSM power consumption is about 50% if comparing to normal standby […]