TDK Corporation announces the InvenSense ICP-20100 platform, the latest technology advancement in the SmartPressure product family. The ICP-20100 is a barometric pressure sensor based on MEMS capacitive technology, improving our lead in the development of ultra-low noise at the lowest power and progressing our industry-leading relative accuracy, sensor throughput, and temperature stability. The ICP-20100 achieves […]
Robotics/Drones
tactical grade, force-rebalance SMD MEMS accelerometer includes digital interface
TDK Corporation announces the release of Tronics AXO315, a miniature high-performance 1-axis closed-loop MEMS accelerometer with a 24-bit digital SPI interface and SMD package that reaches quartz sensors performances, outperforms commercial MEMS sensors, and eases integration. The new force-rebalance accelerometer delivers an excellent one-year composite bias repeatability of 1 mg and composite scale factor repeatability […]
Dual-antenna GNSS receiver system boasts sub-decimeter corrections
Septentrio announces the launch of the AsteRx-m3 Sx OEM board. This new dual-antenna receiver combines Septentrio’s latest core GNSS technology with the SECORX-S sub-decimeter correction service, enabling convenient plug-and-play positioning. High-accuracy positioning is available directly out of the box as GNSS corrections are automatically streamed to the receiver. This significantly simplifies the user’s GNSS receiver […]
Reference design speeds MCU-based Alexa-Built-in products
STMicroelectronics has released an Amazon-qualified reference design package for smart connected devices leveraging Alexa Voice Service (AVS) Integration for AWS IoT Core, which can be used to create Alexa Built-in products using simple microcontrollers (MCUs). AVS Integration for AWS IoT Core has the ability to transform the way users interact with smart “things,” bringing cloud-based Alexa experiences to items […]
AMD Ryzen embedded V2000 CPUs now on COM express modules
Congatec significantly broadens the application areas of its AMD Ryzen Embedded processor-based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched on the COM Express Compact footprint. The new congatec conga-TCV2 powered by the new Ryzen Embedded V2000 processor impresses with […]
Latest release of ROS allow for rapid development, testing, debugging of distributed robotics system
Real-Time Innovations (RTI) announced the availability of the Connext 6 ROS Middleware Wrapper (RMW) Layer, bringing the field-proven, production-grade strength of RTI Connext 6 to the latest release of the Robot Operating System (ROS 2). Robotics software developers can now leverage the ROS 2 ecosystem together with RTI Connext Tools to more rapidly develop, test, and debug […]
Development kit enables rapid development for 1 kW to 10 kW applications
ON Semiconductor has introduced its advanced and flexible Motor Development Kit to accelerate the development of more efficient motor control solutions for applications ranging from less than 1 kW to over 10 kW. Electric motors account for over half of all the power generated and consumed by industrialized countries. The majority of those motors are […]
Tiny, dual-antenna GPS/GNSS module provides accurate positioning and heading
Septentrio expands its GNSS module portfolio with a mosaic-H heading receiver. With dual antenna capabilities, this surface mount module delivers reliable heading & pitch or heading & roll information on top of centimeter-level positioning. mosaic-H is the new addition to Septentrio’s existing mosaic module family, which already includes high-performance RTK and timing modules as well […]
Multi-Zone, direct Time-of-Flight modules speed scene comprehension efforts
STMicroelectronics has extended its portfolio of FlightSense Time-of-Flight (ToF) sensors with the world’s first 64-zone device that breaks a scene into separate areas to help an imaging system build the most detailed spatial understanding of a scene. This first-of-its-kind product comprises a 940nm Vertical Cavity Surface Emission Laser (VCSEL) light source, a System-on-Chip sensor integrating a VCSEL driver, […]
mmWave radar sensors feature one-inch cube form factor
D3 Engineering announced its DesignCore RS-6843AOP and RS-6843AOPU mmWave Radar Sensors. These miniature sensors enable the implementation of many different mmWave radar algorithms to measure, detect, and track. The production-intent sensors feature a 1-inch cube form factor, heat-spreading metal body, and mounting tabs. They may be used with a PC or embedded platform to facilitate […]