Pixus Technologies has announced a new implementation of its ruggedized enclosure utilizing NI’s Ettus Research brand Software Defined Radio (SDR). The RX310-X03 enclosure is designed to MIL-STD-810 for shock/vibration/environmental and MIL-STD-461 for EMI. It features MIL 38999 connectors for the front and rear I/O interfaces. The conduction-cooled enclosure is also IP67 weatherproof. The RX310-103 version […]
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SMARC modules incorporate i.MX 8M Plus processor for AI, embedded vision processing
Congatec presents its brand new low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision, and artificial intelligence (AI) at embedded world 2021 DIGITAL. With its machine and deep learning capabilities, the new ultra-low-power conga-SMX8-Plus module allows industrial embedded systems to see and analyze their surroundings for situational awareness, […]
Low-power NB2 chipset includes ARM Cortex-M4 MCU
Sony Semiconductor Israel announced the launch of the Altair ALT1255, a new low-power NB2 chipset. The ALT1255 is 5G ready, designed with an integrated SIM (iSIM), user MCU, rich application layer, and GSM/GPRS fallback modem. The ALT1255 chipset empowers device manufacturers to develop low-power, cost-sensitive connected devices at a global scale to monitor, manage, and […]
Automotive 4D imaging radar platform uses COTS components
RadSee Technologies Ltd. announced the availability of the automotive industry’s first 4D imaging radar for ADAS and autonomous vehicles able to deliver ultra-high performance and scalability to OEMs and Tier 1 suppliers at up to one-third the cost of previous solutions. By combining the company’s algorithms and patented antenna and system architecture with 77GHz commercial off-the-shelf […]
GPU-enabled deep learning acceleration platform targets AI Inferencing at the Edge
ADLINK Technology Inc. has launched one of the most compact GPU-enabled deep learning acceleration platforms on the market with its latest DLAP x86 series. The DLAP x86 series targets the deployment of deep learning in volume, at the edge where data is generated and actions are taken. It is optimized to deliver AI performance in […]
RF front-end for GNSS receivers includes impedance-matching, ESD protection
STMicroelectronics’ BPF8089-01SC6 RF front-end for Global Navigation Satellite System (GNSS) receivers simplifies design and saves real-estate by integrating the impedance-matching and electrostatic-discharge (ESD) protection circuitry typically implemented using discrete components. The BPF8089-01SC6 provides a 50Ω matched interface between the receiver’s antenna and low-noise amplifier (LNA) and is ready to plug-and-play with ST’s STA8089 and STA8090 […]
LCDs target stretched, square, round-shaped display needs
DATA MODUL Inc. is expanding its Public Information Display (PID) portfolio by introducing the Tartan LCD display family from AU Optronics (AUO). With this new product family, DATA MODUL Inc. now offers non-standard displays for applications with challenging display requirements and limited advertising space. Thus, the new LCD displays family becomes attractive for public transport, […]
Development platform meets new vehicle architecture demands
NXP Semiconductors has announced BlueBox 3.0, a new and expanded version of NXP’s flagship safe Automotive High-Performance Compute (AHPC) development platform. Designed for software application development and validation ahead of silicon device availability, BlueBox 3.0 now offers a flexible way to address user-defined vehicles, safety Level 2+ (L2+) automated driving, and the evolving vehicle architectures […]
MEMS motion sensor/software combo targets smart TV, robotics, AR/VR, wearables, IoT apps
TDK Corporation announces the availability of the InvenSense ICM-40627 and ICM-42688-V high-performance MEMS motion tracking solutions (6-axis IMU + dedicated software library). As a leader in consumer IoT, TDK continues to provide a complete suite of SmartMotion sensor solutions for a broad range of consumer and IoT applications. In addition, a comprehensive development platform, the […]
Low-power MEMS barometric pressure sensor targets drone, IoT apps
TDK Corporation announces the InvenSense ICP-20100 platform, the latest technology advancement in the SmartPressure product family. The ICP-20100 is a barometric pressure sensor based on MEMS capacitive technology, improving our lead in the development of ultra-low noise at the lowest power and progressing our industry-leading relative accuracy, sensor throughput, and temperature stability. The ICP-20100 achieves […]
