The industry’s first disaggregated eFPGA-enabled chiplet template solution is based on QuickLogic’s Australis eFPGA IP Generator and industry-leading chiplet interfaces from eTopus. The template delivers unprecedented design flexibility and bandwidth for high-performance applications. Unlike discrete FPGAs with pre-determined resources of FPGA LUTs, RAM, and I/Os, the disaggregated eFPGA-enabled chiplet template will be available initially as […]
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Rad-hard eFPGA IP works with 90-nm rad-hard fab process
QuickLogic Corporation announced it has teamed with SkyWater Technology to make a “fast boot” rad-hard eFPGA IP available to users of SkyWater’s 90 nm rad-hard (RH90) process. This technology can be embedded as an IP core in ASIC and SoC devices or implemented as a custom rad-hard FPGA for mission-critical and/or ruggedized applications. QuickLogic’s eFPGA […]
SRAM-based FPGAs feature 55-uA consumption, tiny footprint
QuickLogic Corporation announced that its PolarPro 3 family of low power, SRAM-based FPGAs are available to solve semiconductor supply availability challenges. This highly flexible family features power consumption as low as 55uA and a tiny footprint in small packages, as well as die options. Packed into the small physical die size is up to 2,000 effective logic cells […]
eFPGA block tools enable fast designs on UMC 22-nm process
QuickLogic Corporation announced the availability of its first customer-defined eFPGA block from the Australis IP Generator for the UMC 22nm process. The Australis tool enables rapid eFPGA IP generation for nearly any foundry and node. This eFPGA IP core is available now, and any future customizations of it for companies using this same foundry/process node combination can […]
IP generator enables rapid prototyping of customizable FPGA architectures
QuickLogic Corporation announced its new Australis embedded FPGA (eFPGA) IP Generator. This groundbreaking tool is a culmination of the company’s three decades of deep domain expertise in designing and shipping programmable logic architectures that are silicon-efficient, reliable, high quality, and manufacturable at scale, implemented using the silicon automation design techniques of the OpenFPGA open-source framework. […]
Dev kit combines MCU, eFPGA SoC for easy connection to sensors
QuickLogic Corporation announced that it is co-launching the new SparkFun Thing Plus – QuickLogic EOS S3 development kit, featuring a small form factor board with a QuickLogic EOS S3 SoC with Crowd Supply and SparkFun Electronics. This new dev kit includes the Qwiic Connect System enabling users to easily complement the embedded FPGA and MCU on the […]
Smart hearable reference design speeds development of voice-initiated, hands-free Alexa built-in devices
QuickLogic Corporation announced it has released an Amazon-qualified reference design that empowers OEMs and ODMs to evaluate and develop their own smart hearable products quickly and easily. This kit integrates the Alexa voice-initiated Close-Talk experience, enabling a broad set of battery-powered applications to communicate directly with Alexa for a multitude of use cases. This is […]
Open-source SoC dev kit fits in USB port
QuickLogic Corporation announced the introduction of its new Qomu development kit, a tiny form factor Arm Cortex-M4F MCU + eFPGA combination that fits into a USB Type-A port. Optimized for the QuickLogic Open Reconfigurable Computing (QORC) initiative, the kit is supported by a wide variety of vendor-supported open source development tools, including Zephyr, FreeRTOS, SymbiFlow, and […]
Open-source MCU/eFPGA SoC development kit fits in a USB port
QuickLogic Corporation announced the introduction of its new Qomu development kit, a tiny form factor Arm Cortex M4F MCU + eFPGA combination that fits into a USB Type-A port. Optimized for the QuickLogic Open Reconfigurable Computing (QORC) initiative, the kit is supported by a wide variety of vendor-supported open source development tools, including Zephyr and […]
Embedded FPGA IP works on 28-nm FD–SOI-based ICs
QuickLogic Corporation announced the availability of its ArcticPro 3 embedded FPGA (eFPGA) IP, which is now available on Samsung’s 28nm FD–SOI process, enabling OEMs and semiconductor companies to seamlessly integrate the capability of discrete FD-SOI FPGAs into their own ASICs/SoCs, greatly optimizing system performance, power consumption and cost for Edge AI use cases in consumer, IoT, and automotive […]
