ASRock Industrial unveils its newest range of industrial motherboards, powered by Intel Core Ultra 200S Processors (Arrow Lake-S) with Intel 800 series chipsets. Featuring an advanced hybrid architecture with up to 24 cores and an upgraded NPU, these motherboards empower exceptional edge performance, energy efficiency, and enhanced AI acceleration for complex AI-driven workloads. The new range […]
Artificial intelligence/ML
Edge GenAI SoC supports 12 simultaneous 1080p30 video streams
Ambarella, Inc. announced during CES the N1-655 edge GenAI system-on-chip (SoC), which provides on-chip decode of 12x simultaneous 1080p30 video streams, while concurrently processing that video and running a hybrid of multiple, multimodal vision-language models (VLMs) and traditional CNNs. This SoC’s high AI processing performance supports most of the popular multimodal VLMs and large-language models […]
Die-to-die interconnect achieves 64 Gbps data rates with enhanced protocol support
Alphawave Semi introduces the industry’s first 64 Gbps Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP Subsystem to deliver unprecedented chipset interconnect data rates, setting a new standard for ultra-high-performance D2D connectivity solutions in the industry. The third generation, 64 Gbps IP Subsystem builds on the successes of the most recent Gen2 36 Gbps IP […]
MCU features neural-ART accelerator for edge processing
STMicroelectronics is making embedded artificial intelligence (AI) truly here-to-help with a new microcontroller series integrating, for the first time, accelerated machine learning (ML) capabilities. This enables cost-sensitive, power-conscious consumer and industrial products to provide high-performance features leveraging computer vision, audio processing, sound analysis, and other algorithms, until now beyond the capabilities of small embedded systems. […]
Memory controllers support 12.8 GB/s data rates
Renesas Electronics Corporation announced that it has delivered the industry’s first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs). The new DDR5 MRDIMMs are needed to keep pace with the ever-increasing memory bandwidth demands of Artificial Intelligence (AI), High-Performance computing (HPC), and other data center applications. They […]
How are AI and ML used for advanced threat detection?
The increasing number of threat vectors and the growing size of the attack surface in today’s communication and computer networks demand more powerful and faster threat detection. Legacy tools are no longer adequate. To ensure cybersecurity, high-speed threat detection based on artificial intelligence (AI) and machine learning (ML) is increasingly being deployed. This article reviews […]
Eight-channel SerDes device targets AI data center power efficiency
Point2 Technology announced its P1B121 Smart Retimer system-on-chip (SoC) for Active Electrical Cable (AEC) applications in AI/ML data centers. The chip integrates eight unidirectional SerDes channels supporting 112G PAM4 and 56G NRZ data rates, consuming 3.0 W of power for 112G PAM4 operation. The solution addresses growing data center power demands, as AI/ML workloads now […]
FPGA bridge connects MIPI CSI-2 sensors to NVIDIA Holoscan
Microchip Technology has released its PolarFire® FPGA Ethernet Sensor Bridge, which works with the NVIDIA Holoscan sensor processing platform, to enable developers to build artificial intelligence (AI)- driven sensor processing systems. PolarFire FPGAs enable multi-protocol support, and this first solution to be released as part of Microchip’s platform is compatible with MIPI® CSI-2®-based sensors and the MIPI D-PHY℠ […]
Wi-Fi camera reference design features 4K video
InnoPhase IoT, Inc. announces an AI-enabled Wi-Fi battery camera reference design and development platform with 4K video and H.265 support. The collaboration pairs InnoPhase IoT’s power-optimized Talaria TWO (T2) Wi-Fi platform and Ingenic’s T41 AI-enabled video ISP with deep learning algorithms for a complete power-optimized device with 2-4X battery life improvement. The platform’s ultra-low power (ULP) […]
Expanded processing capabilities for automotive, solar, and industrial applications
Texas Instruments will demonstrate several new developments in industrial automation, robotics, automotive, and renewable energy applications at electronica 2024. For factory automation, TI is presenting certified hardware and software for industrial communications using PROFINET®, EtherCAT® and EtherNet/IP™ software stacks. The technology enables connectivity and real-time motor control through single-chip solutions and licensed software for multi-protocol industrial […]
