Thales announces at Sensors Expo 2018, the availability of its NavChip2, the latest in its family of high precision Inertial Measurement Units (IMUs). The NavChip2 provides the highest performance to price in the market of 6-axis IMU’s and is fully factory calibrated. Embedded temperature sensors enable excellent compensation over the entire -40 °C to +85 […]
AR/VR
Eight-bit MCUs incorporate dual ADCs for synchronous sampling
AVR microcontrollers (MCUs) have long been used to create highly responsive sensor nodes because of their cost effectiveness and ease of implementation. To enhance the capability and responsiveness of applications in these settings, Microchip Technology Inc. has expanded its tinyAVR MCU series to include two new devices with advanced analog features and the largest memory variant in the […]
SoC design software runs analysis of peak power use
Synopsys, Inc. today introduced PrimePower, an expanded power analysis solution created to accelerate system-on-chip (SoC) design closure by extending signoff power analysis to drive early design implementation and accurate reliability analysis. Revolutionary technologies based on Synopsys’ golden PrimeTime static timing analysis and signoff empower designers to perform faster and uniquely accurate power analysis and power-driven optimizations […]
Next gen VR reference platform supports smartphones, headsets
Qualcomm Technologies, Inc. unveiled a new virtual reality (VR) reference platform based on the powerful Qualcomm Snapdragon 845 Mobile Platform. Debuting at the Snapdragon Tech Summit in December, the Snapdragon 845 Mobile Platform features a variety of new architectures and subsystems engineered to deliver one-of-a-kind experiences that blur the lines between the physical and virtual […]
AI neural network processing unit hits up to 2.4 TOPs
At CES2018, Rockchip released its first AI processor RK3399Pro with super performance, providing one-stop turnkey solution for AI (artificial intelligence). Computing performance of its NPU (Neural Network Processing Unit) reaches 2.4TOPs. RK3399Pro has the advantages of high performance, low power consumption and easily development. RK3399Pro AI processor with superior general computing performance adopts big.LITTLE CPU, […]
Making sense of displays: OLED, AMOLED, POLED, PMOLED and T-OLED
Organic Light-Emitting Diode (OLED) displays are made using organic light emitting diodes, which emit light when current runs through them. The basic colors of light for these diodes are Red, Green, and Blue (RGB), which combine to create an extensive range of colors of visible light. OLED displays are different from Liquid Crystal Displays (LCDs) […]
Universal FLASH storage devices use 64-layer BiCS FLASH 3D memory
Toshiba Memory America, Inc. (TMA) has begun sampling Universal Flash Storage (UFS) devices[ utilizing its cutting-edge 64-layer BiCS FLASH 3D flash memory. The new UFS devices meet performance demands for applications that require high-speed read/write performance and low power consumption, including mobile devices such as smartphones and tablets and augmented /virtual reality systems. The new lineup will be […]
Camera module boosts processing power of 3D sensing applications
CEVA, Inc. announced today a partnership with LG Electronics to deliver a high-performance, low-cost smart 3D camera solution for consumer electronics and robotic applications with a 3D camera module incorporates a Rockchip RK1608 coprocessor with multiple CEVA-XM4 imaging and vision DSPs. The DSPs provide the processing power to perform a wide variety of 3D sensing applications. […]
World’s first blockchain platform for AR/VR/3D content
Cappasity announced today it is developing an AR/VR blockchain ecosystem designed to enable fast and easy AR/VR/3D content creation. The platform will be powered by ARToken (ART), a virtual currency for trading the content inside the ecosystem. The virtual currency will be made available as a result of Cappasity’s upcoming $50M token crowdsale scheduled for […]
