Tria Technologies has launched two new Qseven (Q7) Computer-on-Modules (COMs), ensuring Q7 designs remain viable until at least 2034, with an optional extension to 2039. The new modules, TRIA-Q7-ASL and TRIA-Q7-ALN, are based on the popular Q7 entry-level standard and provide both a substantial performance boost and a guaranteed product lifetime extension, making Q7 a […]
Industrial
Dual-band Wi-Fi 6 MCUs target IoT
Renesas introduced the RA6W1 dual-band Wi-Fi 6 wireless MCU (datasheet) and announced the RA6W2 variant integrating Wi-Fi 6 + Bluetooth LE for always-connected IoT designs in smart home, industrial, medical, and consumer devices. Based on an Arm Cortex-M33 at 160 MHz with 704 KB SRAM, the devices support 2.4/5 GHz operation and low-power modes down to 200 nA–4 […]
Chip antennas let you add three Wi-Fi bands to IoT devices
Taoglas announced the expansion of its embedded antenna portfolio with a new range of Low Temperature Co-fired Ceramic (LTCC) chip antennas optimized for Wi-Fi 6/7, Ultra-Wideband (UWB), and ISM connectivity. The new ILA.257, ILA.68, and ILA.89 deliver exceptional performance in ultra-compact packages – with minimal keep out area – designed for next-generation IoT, consumer, industrial, and wearable applications […]
Compact module targets edge systems requiring on-device AI processing
congatec has introduced its first COM-HPC Mini computer-on-module based on Qualcomm Dragonwing IQ-X Series processors. The conga-HPC/mIQ-X uses the Qualcomm Oryon CPU and an integrated Hexagon NPU to support local AI workloads, including machine learning inference and large language model execution. The module delivers up to 45 TOPS of AI performance and is intended for […]
Zigbee 4.0 adds 800/900 MHz and new security features
The Connectivity Standards Alliance has introduced Zigbee 4.0, along with Suzi, a Sub-GHz mesh extension designed to increase range and improve network reliability for IoT devices. Zigbee 4.0 updates the architecture used by existing Zigbee and Smart Energy devices, allowing both technologies to operate on a unified network and simplifying certification and integration processes. The […]
RCP endpoints aim to simplify distributed nodes in SDV architectures
Microchip Technology has introduced the LAN866x family of 10BASE-T1S endpoint devices, which incorporate Remote Control Protocol (RCP) to extend Ethernet connectivity to the outermost edge of in-vehicle networks. The devices are intended to support automotive manufacturers moving toward zonal architectures and software-defined vehicle platforms, where the number of distributed sensors and actuators continues to increase. […]
MCU offers 371 DMIPS performance and advanced hardware accelerators
Nuvoton Technology has released the NuMicro M5531 series of microcontrollers, designed for embedded systems that require high computing performance and advanced signal processing. Based on the Arm Cortex-M55 processor, the devices operate at speeds up to 220 MHz and deliver up to 371 DMIPS of processing capability. The series provides strong noise immunity, verified by […]
AI chatbot supports PLC selection and configuration tasks
TRi PLC has released an AI-based chatbot designed to provide faster access to product information and technical support resources. The system uses natural language processing and a structured product knowledge base to interpret user questions and return detailed, context-relevant information. The chatbot assists engineers and system designers in identifying appropriate PLC models by comparing application […]
Compact PCI Express Mini Card provides simultaneous analog input and output
ACCES I/O Products, Inc. has released the mPCIe-DAAI16-8F, a multifunction analog input/output module for embedded and OEM systems. The unit fits the PCI Express Mini Card (mPCIe) Type F1 form factor and provides 16-bit precision with simultaneous analog input and output capabilities. It includes eight analog outputs that support both voltage and current operation and […]
AI accelerator supports on-chip learning for embedded devices
BrainChip Holdings has announced the AKD1500 co-processor capable of delivering up to 800 giga operations per second (GOPS) while operating below 300 milliwatts, providing a power-efficient solution for edge AI tasks. This makes it suitable for use in battery-powered or thermally constrained systems such as wearable electronics, smart sensors, and compact embedded devices. The co-processor […]
