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Featured

A survey of Wi-Fi connectivity modules for IoT applications: part 2

March 12, 2025 By Rakesh Kumar Leave a Comment

This second part of the multipart FAQ will focus on Wi-Fi modules from u-blox and Microchip Technology. u-blox, a Swiss company primarily known for GPS and cellular technologies, has recently expanded into Wi-Fi modules. Microchip Technology is based in the US and is known for developing low-power connectivity options for IoT applications. u-blox: MAYA-W4 Series […]

Filed Under: FAQ, Featured, IoT, Wifi Tagged With: FAQ

A survey of Wi-Fi connectivity modules for IoT applications part 1

March 5, 2025 By Rakesh Kumar Leave a Comment

Wi-Fi connectivity has become important for many IoT ecosystems, enabling data exchange with cloud servers and facilitating real-time monitoring. This multipart FAQ on Wi-Fi connectivity for modules for IoT applications will focus on 10 prominent manufacturers and their modules that every electronics engineer should know. This first part focuses on Expressif Systems and Texas Instruments, […]

Filed Under: FAQ, Featured, IoT, Wifi Tagged With: FAQ

A survey of Bluetooth connectivity modules for IoT applications: part 4

February 26, 2025 By Rakesh Kumar Leave a Comment

This final part of the FAQ covers the Bluetooth connectivity modules from Nordic Semiconductor and STMicroelectronics. The modules covered are based on higher processing power and advanced versions of ARM Cortex processors. Nordic Semiconductor: nRF54L Series The nRF54L series (Figure 1) from Nordic Semiconductor features a 128 MHz Arm Cortex-M33, providing sufficient processing power for […]

Filed Under: FAQ, Featured, IoT Tagged With: nordicsemiconductor, STMicroelectronics, zigbeealliance

A survey of Bluetooth connectivity modules for IoT applications: part 3

February 19, 2025 By Rakesh Kumar Leave a Comment

Microchip Technology and Qualcomm have their own proprietary SoC in their Bluetooth modules. In this third part of the FAQ series, we discuss the RNBD350 and QCC711 Bluetooth low-energy (BLE) modules and explore their development kits. Microchip Technology: RNBD350 The RNBD350 is a compact BLE 5.2 module based on Microchip Technology’s PIC32CX-BZ3 SoC, designed to […]

Filed Under: FAQ, Featured, IoT Tagged With: microchip, qualcomm

A survey of Bluetooth connectivity modules for IoT applications: part 2

February 12, 2025 By Rakesh Kumar Leave a Comment

This second part of the FAQ series will cover Bluetooth modules from Texas Instruments and Quectel, focusing on ARM processors. Despite having a common processor with different processing speeds, these modules have unique features that make them suitable for different IoT applications. Texas Instruments: CC2745R-Q1 The CC2745R-Q1 Bluetooth module from Texas Instruments features a powerful […]

Filed Under: Automotive, FAQ, Featured, IoT, Wireless Tagged With: quectel, texas instruments

A survey of Bluetooth connectivity modules for IoT applications: part 1

February 5, 2025 By Rakesh Kumar Leave a Comment

Bluetooth connectivity continues to gain traction for IoT applications because of its unique features, such as Bluetooth Low Energy (BLE), effectiveness in short-range communications, and lower cost deployment. This multipart FAQ series will cover several manufacturers, including Silicon Labs and Infineon Technologies, characterized by ARM Cortex processors. Silicon Labs: EFR32BG26 Series 2 Bluetooth SoC The […]

Filed Under: FAQ, Featured, IoT Tagged With: infineon, siliconlabs

Teardown: AMD Radeon HD 7970 graphics card

January 31, 2025 By Martin Rowe 3 Comments

Identifying the components reveals clues as to how a graphics card works, assuming you can read the identifying marks and find documentation. Wandering through an electronics swapfest, I found someone selling a graphics card and wondered what was inside. I bought it for $20, opened the case, and looked up the architecture and components. Released […]

Filed Under: Consumer Electronics, Controllers, Converters, FAQ, Featured, Processors, Teardowns Tagged With: amd, infineon, nxpsemiconductor, texasinstruments

What are the different MLPerf benchmarks from MLCommons?

January 29, 2025 By Aharon Etengoff Leave a Comment

Formulated and managed by MLCommons, MLPerf benchmarks measure key operational parameters of artificial intelligence (AI) accelerators across multiple industries. These standardized metrics help semiconductor companies optimize performance and support the development of efficient AI chip designs. This article discusses MLPerf’s crucial role in facilitating comprehensive benchmark testing for tiny and edge computing systems while scaling […]

Filed Under: Artificial intelligence/ML, FAQ, Featured

Accelerating high-performance AI workloads with photonic chips

January 22, 2025 By Aharon Etengoff Leave a Comment

Artificial intelligence (AI) and machine learning (ML) continue to push the limits of conventional semiconductor architectures. To increase speeds, lower latency, and optimize power consumption for high-performance workloads, semiconductor companies and research institutions are developing advanced photonic chips that operate on the principles of light rather than electrical currents. This article discusses the limitations of […]

Filed Under: Applications, Artificial intelligence/ML, FAQ, Featured Tagged With: FAQ

What’s new with Matter: how Matter 1.4 is reshaping interoperability and energy management

January 14, 2025 By Rob Alexander, Silicon Labs Principal Product Manager Leave a Comment

Since its initial launch in 2022, Matter has led the charge on making smart homes smarter – allowing devices from different manufacturers and ecosystems, like Apple Home and Amazon Alexa, to communicate seamlessly. The open-source, IP-based protocol has become a key player in the push for device interoperability, aiming to create a reliable user experience […]

Filed Under: Applications, Connectivity, Consumer Electronics, FAQ, Featured, Featured Contributions, IoT, Wireless Tagged With: Matter, Silicon Labs

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Featured Contributions

Can chiplets save the semiconductor supply chain?

Navigating the EU Cyber Resilience Act: a manufacturer’s perspective

The intelligent Edge: powering next-gen Edge AI applications

Engineering harmony: solving the multiprotocol puzzle in IoT device design

What’s slowing down Edge AI? It’s not compute, it’s data movement

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AI and high-performance computing demand interconnects that can handle massive data throughput without bottlenecks. This Tech Toolbox explores the connector technologies enabling ML systems, from high-speed board-to-board and PCIe interfaces to in-package optical interconnects and twin-axial assemblies.

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