Infineon is launching a next-generation analog MEMS microphone that renders even better results – the XENSIV MEMS microphone IM73A135. In microphones, designers often have to accept trade-offs: high signal-to-noise ratio (SNR), a small package, high acoustic overload point, low power consumption, MEMS versus electret condenser microphones (ECM). For this reason, applications that require the highest […]
Neural net ICs target audio and sensor processing apps
Syntiant Corp. announced the availability of its Syntiant NDP120 Neural Decision Processor (NDP), the latest generation of special-purpose chips for audio and sensor processing for always-on applications in battery-powered devices. The NDP120 applies neural processing to run multiple applications simultaneously with minimal battery power consumption, including echo-cancellation, beamforming, noise suppression, speech enhancement, speaker identification, keyword […]
Smartphone image sensors combine 1-micron pixels, ultra-high gain, multi-sampling de-noise
OmniVision Technologies, Inc. announced in advance of CES the OV40A, a 40MP, 1.0-micron pixel image sensor that features super high gain and de-noise technologies for the best-in-class low light camera performance in the 1/1.7” optical format. This sensor also offers multiple high dynamic range (HDR) options for the best quality still and video captures. Additionally, it supports 1080p slow-motion and high-speed video captures at […]
Flash programmer gets quad-mode capability for QSPI flashes
SEGGER adds quad mode programming for QSPI Flashes to its universal flash programmer, maximizing programming speed for production environments. Flasher PRO ensures that the time gained using 4-pin transfer translates directly to increased productivity. Operating in either PC-based or stand-alone mode, the Flasher PRO reaches the theoretical minimum programming time of the QSPI device itself. […]
4-MP, 2-u image sensors target IoT security cameras
OmniVision Technologies, Inc. announced in advance of CES the OS04C10, the best-in-class 2.0-micron pixel, 4 megapixel (MP) resolution image sensor for both IoT and home security cameras. When paired with the designer’s selected platform, the OS04C10 can enable a system ultra low power mode for battery-powered cameras with AI functionality. Additionally, it provides high 2688 […]
LTE Cat 1 chip platform handles VoLTE/100 kbps IoT apps
Sequans Communications S.A. announced that its second-generation LTE Cat 1 chip platform, Calliope 2, will soon be sampling. Calliope 2 is designed for the cost-effective support of IoT applications that require VoLTE and a data rate higher than 100 kilobits per second that cannot be supported by LTE-M or NB-IoT technologies. Typical Calliope 2 applications […]
Bluetooth LE/802.15.4 wireless modules incorporate STM32 MCUs
STMicroelectronics is offering a solution to accelerate the market introduction of new Bluetooth LE and 802.15.4 based IoT devices with a miniature, ready-to-use STM32 wireless microcontroller (MCU) module. The 7mm x 11.3mm STM32WB5MMG module lets product teams build connected devices without needing wireless-design skills. Made to enable low-cost PCB technology requiring a minimal number of layers, it integrates everything […]
New 0.7-Micron pixel smartphone image sensor brings 32-MP resolution to selfie cameras
OmniVision Technologies, Inc. announced in advance of CES the OV32B image sensor, featuring a 0.7-micron pixel size to provide 32 megapixel (MP) resolution in a 1/3” optical format. This enables smartphone designers to offer the highest possible front-facing, selfie camera resolution in the limited space available. The OV32B also supports 2- and 3-exposure HDR timing for up to […]
ASICs optimized for entry-level, stand-alone driver monitoring systems
OmniVision Technologies, Inc. announced in advance of CES the OAX8000 AI-enabled, automotive application-specific integrated circuit (ASIC), which is optimized for entry-level, stand-alone driver monitoring systems (DMS). The OAX8000 uses a stacked-die architecture to provide the industry’s only DMS processor with on-chip DDR3 SDRAM memory (1GB). This is also the only dedicated DMS processor to integrate a neural processing […]
176-layer, 4D NAND flash improves bit productivity
SK Hynix Inc. announced the completion of developing the industry’s most multilayered 176-layer 512 Gigabit (Gb) Triple-Level Cell (TLC) 4D NAND flash. The Company provided the samples to controller companies last month to make a solution product. SK Hynix has been promoting 4D technology from the 96-layer NAND flash products that combine Charge Trap Flash […]
