Sequans Communications S.A. announced that its second-generation LTE Cat 1 chip platform, Calliope 2, will soon be sampling. Calliope 2 is designed for the cost-effective support of IoT applications that require VoLTE and a data rate higher than 100 kilobits per second that cannot be supported by LTE-M or NB-IoT technologies. Typical Calliope 2 applications […]
Bluetooth LE/802.15.4 wireless modules incorporate STM32 MCUs
STMicroelectronics is offering a solution to accelerate the market introduction of new Bluetooth LE and 802.15.4 based IoT devices with a miniature, ready-to-use STM32 wireless microcontroller (MCU) module. The 7mm x 11.3mm STM32WB5MMG module lets product teams build connected devices without needing wireless-design skills. Made to enable low-cost PCB technology requiring a minimal number of layers, it integrates everything […]
New 0.7-Micron pixel smartphone image sensor brings 32-MP resolution to selfie cameras
OmniVision Technologies, Inc. announced in advance of CES the OV32B image sensor, featuring a 0.7-micron pixel size to provide 32 megapixel (MP) resolution in a 1/3” optical format. This enables smartphone designers to offer the highest possible front-facing, selfie camera resolution in the limited space available. The OV32B also supports 2- and 3-exposure HDR timing for up to […]
ASICs optimized for entry-level, stand-alone driver monitoring systems
OmniVision Technologies, Inc. announced in advance of CES the OAX8000 AI-enabled, automotive application-specific integrated circuit (ASIC), which is optimized for entry-level, stand-alone driver monitoring systems (DMS). The OAX8000 uses a stacked-die architecture to provide the industry’s only DMS processor with on-chip DDR3 SDRAM memory (1GB). This is also the only dedicated DMS processor to integrate a neural processing […]
176-layer, 4D NAND flash improves bit productivity
SK Hynix Inc. announced the completion of developing the industry’s most multilayered 176-layer 512 Gigabit (Gb) Triple-Level Cell (TLC) 4D NAND flash. The Company provided the samples to controller companies last month to make a solution product. SK Hynix has been promoting 4D technology from the 96-layer NAND flash products that combine Charge Trap Flash […]
Automotive antenna-on-package mmWave radar sensor features 1-in-cube form factor
D3 Engineering announced their DesignCore RS-6843AOPUA mmWave Radar Sensor. This miniature automotive interior sensor enables the implementation of many different mmWave radar algorithms to measure, detect, and track. The production-intent unit features a 1-inch cube form factor, heat-spreading metal body, and mounting tabs. It may be used with a PC or embedded platform to facilitate […]
4D imaging radar on-a-chip is automotive-grade, AEC-Q100 qualified
Vayyar has introduced its Radar-on-Chip (RoC) platform, which enables OEMs to achieve leading-edge vehicle safety while achieving cost efficiencies. Vayyar’s automotive-grade, AEC-Q100 qualified RoC chip features up to 48 transceivers, an internal digital signal processor (DSP), and a microcontroller unit (MCU) for real-time signal processing. Capable of seeing through objects and able to operate […]
J-Link Remote Servers speed embedded system debugging
SEGGER announces that it now operates a worldwide network of J-Link Remote Servers, enabling a user to debug target systems from anywhere in the world at even higher speeds than before. The J-Link Remote Servers are available to every J-Link user at no cost. While using the closest server significantly increases communication speed, customers still […]
RISC-V build tools support Linux-based frameworks for automated build/test processes
IAR Systems releases an update of its RISC-V build tools supporting implementation in Linux-based frameworks for automated application build and test processes. This addition further extends IAR Systems’ offering for flexible automated workflows, enabling streamlined workflows from the developer environment to Continuous Integration (CI). Thanks to the tools including the static code analysis tool C-STAT, […]
Dev kit simplifies development of 3D machine control and guidance systems
ACEINNA announced the general market availability of ACEINNA OpenRTK330LI EVK, a complete evaluation, and a development kit for the OpenRTK330LI GNSS/INS module. The OpenRTK330LI EVK accelerates development and reduces time to market of custom navigation and guidance systems fusing inertial measurements and multi-band RTK/GNSS positioning. The OpenIMU330LI Module is a very compact, low cost, state-of-the-art, […]
