The Intel® Core™ Ultra 200HX Plus series from Intel includes mobile processors such as the Core Ultra 9 290HX Plus and Core Ultra 7 270HX Plus, designed for gaming, content creation and workstation applications. The processors feature higher die-to-die frequencies, support for the Intel Binary Optimization Tool to improve instruction efficiency, and connectivity including Wi-Fi […]
Consumer Electronics
QLC UFS 4.1 embedded flash enables higher-capacity mobile storage
The QLC UFS 4.1 embedded memory devices from KIOXIA America, Inc. are based on 8th generation BiCS FLASH™ 3D technology, using 4-bit-per-cell QLC to deliver higher storage density in JEDEC®-standard packages. Available in 512 GB and 1 TB capacities, the devices support the UFS 4.1 specification and provide higher sequential and random performance compared to […]
Next-gen DSP boosts AI and audio processing on power-limited SoCs
The Tensilica HiFi iQ DSP from Cadence is a sixth-generation audio and voice DSP IP based on a new architecture designed for AI-enhanced audio processing in edge devices. The DSP delivers higher compute density and energy efficiency than prior HiFi cores, with support for AI data types such as FP8 and BF16, enhanced vectorization and […]
Gen5 QLC SSD brings PCIe Gen5 to clients
The Micron 3610 NVMe SSD from Micron Technology is a PCIe Gen5 client SSD built on G9 QLC NAND, designed for mainstream PCs and ultra-thin laptops requiring higher throughput and capacity. The drive delivers up to 11,000 MB/s sequential read and 9,300 MB/s sequential write speeds and is available in capacities from 1 TB to […]
Low power software reduces reliance on GNSS
STRIDE from TDK is an embedded pedestrian dead reckoning software solution designed to provide continuous positioning for wearables and small IoT form factors. By combining inertial sensor data with GNSS and opportunistic wireless inputs, STRIDE delivers real-time indoor and outdoor location tracking while reducing power draw and avoiding the need for additional antennas or dedicated […]
Expanded HMI models for defect detection
Lattice Semiconductor announced the latest release of the Lattice sensAI solution stack, delivering expanded model support, enhanced AI performance, and greater deployment flexibility for a wider range of edge applications. With new purpose-built models, upgraded tools, and improved compatibility, Lattice sensAI empowers developers to achieve higher performance, lower power consumption, and faster integration of AI […]
Dual-band Wi-Fi 6 MCUs target IoT
Renesas introduced the RA6W1 dual-band Wi-Fi 6 wireless MCU (datasheet) and announced the RA6W2 variant integrating Wi-Fi 6 + Bluetooth LE for always-connected IoT designs in smart home, industrial, medical, and consumer devices. Based on an Arm Cortex-M33 at 160 MHz with 704 KB SRAM, the devices support 2.4/5 GHz operation and low-power modes down to 200 nA–4 […]
Chip antennas let you add three Wi-Fi bands to IoT devices
Taoglas announced the expansion of its embedded antenna portfolio with a new range of Low Temperature Co-fired Ceramic (LTCC) chip antennas optimized for Wi-Fi 6/7, Ultra-Wideband (UWB), and ISM connectivity. The new ILA.257, ILA.68, and ILA.89 deliver exceptional performance in ultra-compact packages – with minimal keep out area – designed for next-generation IoT, consumer, industrial, and wearable applications […]
Matter-compatible NFC tag supports cryptographic operations via energy harvesting
STMicroelectronics has introduced the ST25DA-C, a secure NFC chip designed for smart-home devices using the Matter 1.5 specification. The device supports NFC-based onboarding so that users can add lighting, access control products, cameras, or other IoT equipment to a home network by tapping a smartphone. The chip is the first commercial component aligned with recent […]
Compact module targets edge systems requiring on-device AI processing
congatec has introduced its first COM-HPC Mini computer-on-module based on Qualcomm Dragonwing IQ-X Series processors. The conga-HPC/mIQ-X uses the Qualcomm Oryon CPU and an integrated Hexagon NPU to support local AI workloads, including machine learning inference and large language model execution. The module delivers up to 45 TOPS of AI performance and is intended for […]
