For developers using RISC-V-based platforms, the architecture offers unique features that can help achieve functional safety and security objectives. From its open architecture to a rich tools ecosystem, safety-critical software teams see benefits in meeting the guidelines of DO-178C and ISO 26262, for example, and opportunities to reduce compliance effort. Understanding how to map RISC-V’s […]
Featured
A survey of Wi-Fi connectivity modules for IoT applications: part 2
This second part of the multipart FAQ will focus on Wi-Fi modules from u-blox and Microchip Technology. u-blox, a Swiss company primarily known for GPS and cellular technologies, has recently expanded into Wi-Fi modules. Microchip Technology is based in the US and is known for developing low-power connectivity options for IoT applications. u-blox: MAYA-W4 Series […]
A survey of Wi-Fi connectivity modules for IoT applications part 1
Wi-Fi connectivity has become important for many IoT ecosystems, enabling data exchange with cloud servers and facilitating real-time monitoring. This multipart FAQ on Wi-Fi connectivity for modules for IoT applications will focus on 10 prominent manufacturers and their modules that every electronics engineer should know. This first part focuses on Expressif Systems and Texas Instruments, […]
A survey of Bluetooth connectivity modules for IoT applications: part 4
This final part of the FAQ covers the Bluetooth connectivity modules from Nordic Semiconductor and STMicroelectronics. The modules covered are based on higher processing power and advanced versions of ARM Cortex processors. Nordic Semiconductor: nRF54L Series The nRF54L series (Figure 1) from Nordic Semiconductor features a 128 MHz Arm Cortex-M33, providing sufficient processing power for […]
A survey of Bluetooth connectivity modules for IoT applications: part 3
Microchip Technology and Qualcomm have their own proprietary SoC in their Bluetooth modules. In this third part of the FAQ series, we discuss the RNBD350 and QCC711 Bluetooth low-energy (BLE) modules and explore their development kits. Microchip Technology: RNBD350 The RNBD350 is a compact BLE 5.2 module based on Microchip Technology’s PIC32CX-BZ3 SoC, designed to […]
A survey of Bluetooth connectivity modules for IoT applications: part 2
This second part of the FAQ series will cover Bluetooth modules from Texas Instruments and Quectel, focusing on ARM processors. Despite having a common processor with different processing speeds, these modules have unique features that make them suitable for different IoT applications. Texas Instruments: CC2745R-Q1 The CC2745R-Q1 Bluetooth module from Texas Instruments features a powerful […]
A survey of Bluetooth connectivity modules for IoT applications: part 1
Bluetooth connectivity continues to gain traction for IoT applications because of its unique features, such as Bluetooth Low Energy (BLE), effectiveness in short-range communications, and lower cost deployment. This multipart FAQ series will cover several manufacturers, including Silicon Labs and Infineon Technologies, characterized by ARM Cortex processors. Silicon Labs: EFR32BG26 Series 2 Bluetooth SoC The […]
Teardown: AMD Radeon HD 7970 graphics card
Identifying the components reveals clues as to how a graphics card works, assuming you can read the identifying marks and find documentation. Wandering through an electronics swapfest, I found someone selling a graphics card and wondered what was inside. I bought it for $20, opened the case, and looked up the architecture and components. Released […]
What are the different MLPerf benchmarks from MLCommons?
Formulated and managed by MLCommons, MLPerf benchmarks measure key operational parameters of artificial intelligence (AI) accelerators across multiple industries. These standardized metrics help semiconductor companies optimize performance and support the development of efficient AI chip designs. This article discusses MLPerf’s crucial role in facilitating comprehensive benchmark testing for tiny and edge computing systems while scaling […]
Accelerating high-performance AI workloads with photonic chips
Artificial intelligence (AI) and machine learning (ML) continue to push the limits of conventional semiconductor architectures. To increase speeds, lower latency, and optimize power consumption for high-performance workloads, semiconductor companies and research institutions are developing advanced photonic chips that operate on the principles of light rather than electrical currents. This article discusses the limitations of […]